PLANE223


2D 8-Node Coupled-Field Solid

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PLANE223 Element Description

PLANE223 supports the following physics combinations:

  • Structural-Thermal

  • Piezoresistive

  • Electrostatic-Structural

  • Piezoelectric

  • Thermal-Electric

  • Structural-Thermoelectric

  • Thermal-Piezoelectric

  • Structural-Magnetic

  • Structural-Electromagnetic

  • Structural-Stranded Coil

  • Thermal-Magnetic

  • Thermal-Electromagnetic

  • Structural-Diffusion

  • Thermal-Diffusion

  • Electric-Diffusion

  • Thermal-Electric-Diffusion

  • Structural-Thermal-Diffusion

  • Structural-Electric-Diffusion

  • Structural-Thermal-Electric-Diffusion

The element has eight nodes with up to six degrees of freedom per node.

Structural capabilities include elasticity, plasticity, hyperelasticity, viscoelasticity, viscoplasticity, creep, large strain, large deflection, and stress stiffening effects. It also has mixed formulation capability for simulating deformations of nearly incompressible elastoplastic materials, and fully incompressible hyperelastic materials.

Piezoresistive capabilities include the piezoresistive effect. Piezoelectric capabilities include direct and converse piezoelectric effects. Electrostatic-structural capabilities include electrostatic force coupling. Thermoelectric capabilities include Seebeck, Peltier, and Thomson effects, as well as Joule heating. In addition to thermal expansion, structural-thermal capabilities include the piezocaloric effect in dynamic analyses. The Coriolis effect is available for analyses with structural degrees of freedom. The thermoplastic and viscoelastic heating effects are available for analyses with structural and thermal degrees of freedom.

Structural-magnetic capabilities include magnetic force coupling. Structural-electromagnetic capabilities include magnetic force coupling, and eddy current and velocity effects in a transient analysis.

Thermal-magnetic and thermal-electromagnetic capabilities include Joule heating. In addition, thermal-electromagnetic capabilities include eddy current effects in a transient analysis, and velocity effects in a static or transient analysis.

The diffusion expansion and hydrostatic stress-migration effects are available for analyses with structural and diffusion degrees of freedom. The thermo-migration effect (Soret effect) and the temperature-dependent saturated concentration effect is available for analyses with thermal and diffusion degrees of freedom. The electro-migration effect is available for analyses with electrical and diffusion degrees of freedom.

See PLANE223 in the Mechanical APDL Theory Reference for more details about this element.

Figure 223.1: PLANE223 Geometry

PLANE223 Geometry

PLANE223 Input Data

The geometry, node locations, and the coordinate system for this element are shown in Figure 223.1: PLANE223 Geometry. The element input data includes eight nodes and structural, thermal, electrical, magnetic, and diffusion material properties. For the plane or plane stress case, you can also specify the element thickness (Z depth) by setting KEYOPT(3) to 3 and inputting the real constant THK.

The type of units (MKS or user defined) for electromagnetic problems is specified via EMUNIT, which also determines the value of free-space permittivity (EPZRO) and free-space permeability (MUZRO).

KEYOPT(1) determines the element degree-of-freedom set and the corresponding force labels and reaction solution. KEYOPT(1) is set equal to the sum of the field keys shown in Table 223.1: PLANE223 Field Keys. For example, KEYOPT(1) is set to 11 for a structural-thermal analysis (structural field key + thermal field key = 1 + 10). For a structural-thermal analysis, UX, UY, and TEMP are the degree-of-freedom labels and force and heat flow are the reaction solution.

KEYOPT(3) = 3 enables you to define constant or varying thickness via the real constant input. To define varying thickness, input a table name (specified as %tablename% and created via *DIM). Tabular thickness can vary in terms of coordinates (X and Y) or node numbers. Supported primary variables for tabular thickness are X, Y, and NODES. (The Function Tool is a convenient way to define your thickness tables; you can use it to define thickness as a function of global/local coordinates.)

Table 223.1: PLANE223 Field Keys

FieldField KeyDOF LabelForce LabelReaction Solution
Structural1UX, UY[a]FX, FYForce
Thermal10TEMPHEATHeat Flow
Electric Conduction100VOLTAMPSElectric Current
Electromagnetic Induction200EMFCURTCurrent
Electrostatic1000VOLTCHRGElectric Charge
Magnetic10000AZCSGZMagnetic Current Segment
Diffusion100000CONCRATEDiffusion Flow Rate

[a] When KEYOPT(3) is set to 6 for analyses with structural degrees of freedom, ROTY is added to the set of degrees of freedom.


The coupled-field analysis KEYOPT(1) settings, degree-of-freedom labels, force labels, reaction solutions, and analysis types are shown in the following table.

Table 223.2: PLANE223 Coupled-Field Analyses

Coupled-Field AnalysisKEYOPT(1)DOF LabelForce LabelReaction SolutionAnalysis Type
Structural-Thermal [1], [2]11

UX, UY,

TEMP

FX, FY,

HEAT

Force,

Heat Flow

Static

Full Harmonic

Full Transient

Piezoresistive101

UX, UY,

VOLT

FX, FY,

AMPS

Force,

Electric Current

Static

Full Transient

Electrostatic-Structural 1001 [3]

UX, UY,

VOLT

FX, FY,

CHRG

Force,

Electric Charge (negative)

Static

Full Transient

Linear Perturbation Static

Linear Perturbation Harmonic

Linear Perturbation Modal

Piezoelectric (Charge-Based)1001 [3]

UX, UY,

VOLT

FX, FY,

CHRG

Force,

Electric Charge (negative)

Static

Modal

Linear Perturbation Modal

Full, Linear Perturbation, or Mode Superposition Harmonic

Full or Mode Superposition Transient

Piezoelectric (Current-Based)101

UX, UY,

VOLT

FX, FY,

AMPS

Force,

Electric Current

Full Harmonic

Full Transient

Thermal-Electric110

TEMP,

VOLT

HEAT,

AMPS

Heat Flow,

Electric Current

Static

Full Transient

Structural-Thermoelectric [1]111

UX, UY,

TEMP,

VOLT

FX, FY,

HEAT,

AMPS

Force,

Heat Flow,

Electric Current

Static

Full Transient

Thermal-Piezoelectric [1], [2]1011

UX, UY,

TEMP,

VOLT

FX, FY,

HEAT,

CHRG

Force,

Heat Flow,

Electric Charge (negative)

Static

Full Harmonic

Full Transient

Structural-Magnetic10001

UX, UY,

AZ,

FX, FY,

CSGZ

Force,

Magnetic Current Segment

Static

Full Transient

Structural-Electromagnetic 10101

UX, UY,

AZ,

VOLT

FX, FY,

CSGZ,

AMPS

Force,

Magnetic Current Segment,

Electric Current

Static

Full Transient

Structural-Stranded Coil10201

UX, UY,

AZ,

VOLT,

EMF

FX, FY,

CSGZ,

AMPS,

CURT

Force,

Magnetic Current Segment,

Electric Current,

Current Flow

Static

Full Transient

Thermal-Magnetic10010

TEMP,

AZ

HEAT,

CSGZ

Heat Flow,

Magnetic Current Segment

Static

Full Transient

Thermal-Electromagnetic10110

TEMP,

VOLT,

AZ

HEAT,

AMPS

CSGZ

Heat Flow,

Electric Current

Magnetic Current Segment

Static

Full Transient

Structural-Diffusion [1]100001

UX, UY,

CONC

FX, FY,

RATE

Force,

Diffusion Flow Rate

Static

Full Transient

Thermal-Diffusion [1]100010

TEMP,

CONC

HEAT,

RATE

Heat Flow,

Diffusion Flow Rate

Static

Full Transient

Electric-Diffusion [1]100100

VOLT,

CONC,

AMPS,

RATE

Electric Current,

Diffusion Flow Rate

Static

Full Transient

Thermal-Electric-Diffusion [1]100110

TEMP,

VOLT,

CONC

HEAT,

AMPS,

RATE

Heat Flow,

Electric Current,

Diffusion Flow Rate

Static

Full Transient

Structural-Thermal-Diffusion [1]100011

UX, UY,

TEMP,

CONC

FX, FY,

HEAT,

RATE

Force,

Heat Flow,

Diffusion Flow Rate

Static

Full Transient

Structural-Electric-Diffusion [1]100101

UX, UY,

VOLT,

CONC

FX, FY,

AMPS,

RATE

Force,

Electric Current,

Diffusion Flow Rate,

Static,

Full Transient

Structural-Thermal-Electric-Diffusion [1]100111

UX, UY,

TEMP,

VOLT,

CONC

FX, FY,

HEAT,

AMPS,

RATE

Force,

Heat Flow,

Electric Current,

Diffusion Flow Rate

Static

Full Transient


  1. For static and full transient analyses, KEYOPT(2) can specify a strong (matrix) or weak (load vector) structural-thermal, structural-diffusion, thermal-diffusion, and electric diffusion coupling.

  2. For harmonic analyses, only strong coupling (KEYOPT(2) = 0) applies.

  3. The electrostatic-structural analysis available with KEYOPT(1) = 1001 defaults to electrostatic force coupling. To turn off the electrostatic force coupling, you can set KEYOPT(4) = 2 for elastic air or KEYOPT(4) = 4 for solid dielectrics, respectively. Alternatively, to do an uncoupled structural-electrostatic analysis, you can specify a negligible piezoelectric coefficient using TBDATA with TB,PIEZ.

As shown in the following tables, material property requirements consist of those required for the individual fields (structural, thermal, electric conduction, electrostatic, magnetic, or diffusion) and those required for field coupling. Individual material properties are defined via the MP and MPDATA commands. Nonlinear and multiphysics material models are defined via the TB command.

Table 223.3: Structural Material Properties


Table 223.4: PLANE223 Material Properties and Material Models

Coupled-Field AnalysisKEYOPT(1)Material Properties and Material Models
Structural-Thermal11StructuralSee Table 223.3: Structural Material Properties
Thermal

KXX, KYY, DENS, C, ENTH, HF

Coupling

ALPX, ALPY, ALPZ, REFT, QRATE

Piezoresistive [1]101StructuralSee Table 223.3: Structural Material Properties
Electric

RSVX, RSVY, PERX, PERY

Coupling

Piezoresistivity

Electrostatic-Structural1001StructuralSee Table 223.3: Structural Material Properties
Electric

PERX, PERY, LSST (and/or RSVX, RSVY)

---

Anisotropic electric permittivity

---

Anisotropic dielectric loss tangent

Piezoelectric

1001

(Charge-Based)

101

(Current-Based)

Structural

See Table 223.3: Structural Material Properties [2]

---

Anisotropic viscosity

---

Anisotropic elastic loss tangent

Electric

PERX, PERY, LSST (and/or RSVX, RSVY)

---

Anisotropic electric permittivity

---

Anisotropic dielectric loss tangent

Coupling

Piezoelectric matrix

Thermal-Electric [1]110Thermal

KXX, KYY, DENS, C, ENTH, HF

Electric

RSVX, RSVY, PERX, PERY

Coupling

SBKX, SBKY

Structural-Thermoelectric111StructuralSee Table 223.3: Structural Material Properties
Thermal

KXX, KYY, DENS, C, ENTH, HF

Electric

RSVX, RSVY, PERX, PERY

Coupling

ALPX, ALPY, ALPZ, REFT, QRATE

---

SBKX, SBKY

---

Piezoresistivity

Thermal-Piezoelectric1011StructuralSee Table 223.3: Structural Material Properties [2]
Thermal

KXX, KYY, DENS, C, ENTH, HF

Electric

PERX, PERY, LSST (and/or RSVX, RSVY)

---

Anisotropic electric permittivity

Coupling

ALPX, ALPY, ALPZ, REFT

---

Piezoelectric matrix

Structural-Magnetic10001StructuralSee Table 223.3: Structural Material Properties
Magnetic

MURX, MURY, MGXX, MGYY

---

Magnetism

ElectricRSVZ [3]
Structural-Electromagnetic10101StructuralSee Table 223.3: Structural Material Properties
Magnetic

MURX, MURY, MGXX, MGYY

---

Magnetism

ElectricRSVZ
CouplingRSVZ
Structural-Stranded Coil10201StructuralSee Table 223.3: Structural Material Properties
Magnetic

MURX, MURY, MGXX, MGYY

---

Magnetism

ElectricRSVX [3]
Thermal-Magnetic10010Thermal

KXX, KYY, DENS, C, ENTH

Magnetic

MURX, MURY, MGXX, MGYY

---

Magnetism

Coupling

RSVZ

Thermal-Electromagnetic10110Thermal

KXX, KYY, DENS, C, ENTH

ElectricRSVZ
Magnetic

MURX, MURY, MGXX, MGYY

---

Magnetism

CouplingRSVZ
Structural-Diffusion [1]100001StructuralSee Table 223.3: Structural Material Properties
Diffusion

DXX, DYY, CSAT

Coupling

BETX, BETY, CREF

---

Migration Model

Thermal-Diffusion [1]100010Thermal

KXX, KYY, DENS, C, ENTH, HF

Diffusion

DXX, DYY, CSAT

Coupling

Temperature-dependent CSAT

---

Migration Model

Electric-Diffusion [1]100100Electric

RSVX, RSVY, PERX, PERY

Diffusion

DXX, DYY, CSAT

Coupling

Migration Model

Thermal-Electric-Diffusion [1]100110Thermal

KXX, KYY, DENS, C, ENTH, HF

Electric

RSVX, RSVY, PERX, PERY

Diffusion

DXX, DYY, CSAT

Coupling

SBKX, SBKY

---

Temperature-dependent CSAT

---

Migration Model

Structural-Thermal-Diffusion [1]100011StructuralSee Table 223.3: Structural Material Properties
Thermal

KXX, KYY, DENS, C, ENTH, HF

Diffusion

DXX, DYY, CSAT

Coupling

ALPX, ALPY, ALPZ, REFT, QRATE

---

BETX, BETY, CREF

---

Temperature-dependent CSAT

---

Migration Model

Structural-Electric-Diffusion [1]100101StructuralSee Table 223.3: Structural Material Properties
Electric

RSVX, RSVY, PERX, PERY

Diffusion

DXX, DYY, CSAT

Coupling

BETX, BETY, CREF

---

Migration Model

Structural-Thermal-Electric-Diffusion [1]100111StructuralSee Table 223.3: Structural Material Properties
Thermal

KXX, KYY, DENS, C, ENTH, HF

Electric

RSVX, RSVY, PERX, PERY

Diffusion

DXX, DYY, CSAT

Coupling

ALPX, ALPY, ALPZ, REFT, QRATE

---

BETX, BETY, CREF

---

SBKX, SBKY

---

Temperature-dependent CSAT

---

Migration Model


  1. For this analysis type, some of the material properties can be defined as a function of primary variables by using tabular input on the MP command. For more information, see Defining Linear Material Properties Using Tabular Input in the Material Reference.

  2. For piezoelectric and thermal-piezoelectric analyses (KEYOPT(1) = 101, 1001, or 1011 with TB,PIEZ), only elastic material properties and material models are valid.

  3. For this coupled analysis type, the specified electrical resistivity (RSVX or RSVZ) is used only for the Joule heat calculation.

Various combinations of nodal loading are available for this element (depending upon the KEYOPT(1) value). Nodal loads are defined with the D and the F commands. Nodal forces, if any, should be input per unit of depth for a plane analysis and on a full 360° basis for an axisymmetric analysis.

Element loads are described in Element Loading. Surface loads may be input on the element faces indicated by the circled numbers in Figure 223.1: PLANE223 Geometry using the SF and SFE commands. Positive pressures act into the element. Body loads may be input at the element's nodes or as a single element value using the BF and BFE commands.

PLANE223 surface and body loads are given in the following table.

Most surface and body loads can be defined as a function of primary variables by using tabular input. For more information, see Applying Loads Using Tabular Input in the Basic Analysis Guide and the individual surface or body load command description in the Command Reference.

Table 223.5: PLANE223 Surface and Body Loads

Coupled-Field AnalysisKEYOPT(1)Load TypeLoadCommand Label
Structural-Thermal11Surface
Pressure
PRES
CONV
HFLUX
RDSF
Body
Force Density
FORC
Heat Generation -- Nodes I through P
HGEN
Piezoresistive and Piezoelectric (Current-Based)101Surface
Pressure
PRES
Body
Force Density
FORC
Temperature -- Nodes I through P
TEMP
Electrostatic-Structural and Piezoelectric (Charge-Based)1001Surface
Pressure
Surface Charge Density
PRES
CHRGS[1]
Body
Force Density
FORC
Temperature -- Nodes I through P
TEMP
Volume Charge Density -- Nodes I through P
CHRGD[1]
Thermal-Electric110Surface
Convection
Heat Flux
Radiation
CONV
HFLUX
RDSF
Body
Heat Generation -- Nodes I through P
HGEN
Structural-Thermoelectric111Surface
Pressure
PRES
CONV
HFLUX
RDSF
Body
Force Density
FORC
Heat Generation -- Nodes I through P
HGEN
Thermal-Piezoelectric1011Surface
Pressure
Surface Charge Density
PRES
CHRGS[1]
CONV
HFLUX
RDSF
Body
Force Density
FORC
Heat Generation -- Nodes I through P
HGEN
Volume Charge Density -- Nodes I through P
CHRGD[1]
Structural-Magnetic10001Surface
Pressure
PRES
Body
Force Density
FORC
Temperature -- Nodes I through P
TEMP
Source Current Density -- Nodes I through P
JS
Structural-Electromagnetic10101Surface
Pressure
PRES
Body
Force Density
FORC
Temperature -- Nodes I through P
TEMP
Structural-Stranded Coil10201Surface
Pressure
PRES
Body
Force Density
FORC
Temperature -- Nodes I through P
TEMP
Thermal-Magnetic10010Surface
Convection
Heat Flux
Radiation
CONV
HFLUX
RDSF
Body
Heat Generation -- Nodes I through P
HGEN
Source Current Density -- Nodes I through P
JS
Thermal-Electromagnetic10110Surface
CONV
HFLUX
RDSF
Body
Heat Generation -- Nodes I through P
HGEN
Velocity -- Nodes I through P
VELO
Structural-Diffusion 100001Surface
Pressure
PRES
Diffusion Flux
DFLUX
Body
Force Density
FORC
Temperature --
Nodes I through P
TEMP
Diffusing Substance Generation --
Nodes I through P
DGEN
Thermal-Diffusion100010Surface
Convection
Heat Flux
Radiation
CONV
HFLUX
RDSF
Diffusion Flux
DFLUX
Body
Heat Generation --
Nodes I through P
HGEN
Diffusing Substance Generation --
Nodes I through P
DGEN
Electric-Diffusion100100Surface
Diffusion Flux
DFLUX
Body
Diffusing Substance Generation --
Nodes I through P
DGEN
Temperature --
Nodes I through P
TEMP
Thermal-Electric-Diffusion100110Surface
Convection
Heat Flux
Radiation
CONV
HFLUX
RDSF
Diffusion Flux
DFLUX
Body
Heat Generation --
Nodes I through P
HGEN
Diffusing Substance Generation --
Nodes I through P
DGEN
Structural-Thermal-Diffusion100011Surface
Pressure
PRES
CONV
HFLUX
RDSF
Diffusion Flux
DFLUX
Body
Force Density
FORC
Heat Generation --
Nodes I through P
HGEN
Diffusing Substance Generation --
Nodes I through P
DGEN
Structural-Electric-Diffusion100101Surface
Pressure
PRES
Diffusion Flux
DFLUX
Body
Force Density
FORC
Diffusing Substance Generation --
Nodes I through P
DGEN
Temperature --
Nodes I through P
TEMP
Structural-Thermal-Electric-Diffusion100111Surface
Pressure
PRES
CONV
HFLUX
RDSF
Diffusion Flux
DFLUX
Body
Force Density
FORC
Heat Generation --
Nodes I through P
HGEN
Diffusing Substance Generation --
Nodes I through P
DGEN

  1. CHRGS and CHRGD are interpreted as negative surface charge density and negative volume charge density, respectively.

Automatic element technology selections are given in the following table (for more information, see Automatic Selection of Element Technologies and Formulations).

Table 223.6: Automatic Element Technology Selection

Coupled-Field AnalysisETCONTROL Command Suggestions/Resettings
All analyses with structural and thermal fieldsKEYOPT(2) = 1 for elastoplastic or hyperelastic materials


A summary of the element input is given in "PLANE223 Input Summary". A general description of element input is given in Element Input. For axisymmetric applications see Harmonic Axisymmetric Elements.

PLANE223 Input Summary

Nodes

I, J, K, L, M, N, O, P

Degrees of Freedom

Set by KEYOPT(1). See Table 223.2: PLANE223 Coupled-Field Analyses.

Real Constants
THK - Thickness if KEYOPT (3) = 3
The following are the real constants for the structural-stranded coil analysis (KEYOPT(1) = 10201):
THK, SC, NC, RAD, TZ, R, SYM

See Table 223.7: PLANE223 Real Constants for more information.

Material Properties

See Table 223.4: PLANE223 Material Properties and Material Models.

Surface Loads

See Table 223.5: PLANE223 Surface and Body Loads.

Body Loads

See Table 223.5: PLANE223 Surface and Body Loads.

Special Features

Note:  Linear perturbation is available for the following coupled analyses: electrostatic-structural and piezoelectric analyses (KEYOPT(1) = 1001).


KEYOPT(1)

Element degrees of freedom. See Table 223.2: PLANE223 Coupled-Field Analyses.

KEYOPT(2)

Coupling method between the degrees of freedom for the following types of coupling: structural-thermal, structural-diffusion, thermal-diffusion, thermal-electric, and electric-diffusion:

0 -- 

Strong (matrix) coupling. May produce an unsymmetric matrix (see note [1]). In a linear analysis, a coupled response is achieved after one iteration.

1 -- 

Weak (load vector) coupling. Produces a symmetric matrix and requires at least two iterations to achieve a coupled response. (See note [2].)


Note:  

  1. In addition to unsymmetric constitutive equations, temperature-dependent thermal conductivity, electrical resistivity, and diffusivity produce unsymmetric matrices. Effects associated with the temperature-dependent material properties are not taken into account with the weak coupling option (KEYOPT(2) = 1).

  2. The weak coupling option (KEYOPT(2) = 1) can be used in a coupled electrostatic-structural analysis (KEYOPT(1) = 1001) to produce legacy element behavior. In this case, the reaction solution for the VOLT degree of freedom is positive charge (CHRG), and the analysis types are limited to static and full transient analyses. Linear perturbation analyses are not supported.


KEYOPT(3)

Element behavior:

0 -- 

Plane or plane stress

1 -- 

Axisymmetric

2 -- 

Plane strain

3 -- 

Plane or plane stress with thickness input

6 -- 

Axisymmetric with torsion


Note:  For the plane/plane stress options (KEYOPT(3) = 0 or 3), the element behavior is plane stress for analyses with structural degrees of freedom. The plane strain (KEYOPT(3) = 2) and axisymmetric with torsion (KEYOPT(3) = 6) options are valid only for analyses with structural degrees of freedom.


KEYOPT(4)

Electrostatic force coupling in electrostatic-structural analysis (KEYOPT(1) = 1001); or electromagnetic force coupling in structural-magnetic (KEYOPT(1) = 10001), structural-electromagnetic (KEYOPT(1) = 10101), and structural-stranded coil (KEYOPT(1) = 10201) analyses:

0 -- 

Applied to every element node. Used to model electrostatic or electromagnetic force coupling in solids.

1 -- 

Applied to the air-structure interface or to element nodes that have constrained structural degrees of freedom. Produces a symmetric force coupling matrix by ignoring some terms associated with the nodes interior to the air domain. Recommended for models with a single layer of elastic air elements without midside nodes.

2 -- 

Not applied. Recommended for elastic air elements not directly attached to the air-structure interface to make the solution more efficient.

3 -- 

Applied to the air-structure interface or to element nodes that have constrained structural degrees of freedom. Compared to KEYOPT(4) = 1, all terms of the force coupling matrix are retained, which produces an unsymmetric matrix. Recommended for models with multiple layers of elastic air elements.

4 -- 

Not applied. Can be used to turn off the default electrostatic or electromagnetic force coupling in solids. Compared to KEYOPT(4) = 2, elements with KEYOPT(4) = 4 can be subject to electrostatic or electromagnetic force coupling when connected to an elastic air element.


Note:  KEYOPT(4) = 1, 2, and 3 are used to identify elastic air elements during the automatic detection of the air-structure interface. The electrostatic or electromagnetic force coupling:

  • Will not be applied to the element nodes connected to another elastic air element.

  • Will be applied to the element nodes connected to a structure, that is, any element with structural degrees of freedom except for the elastic air elements.


For more information, see Electrostatic-Structural Analysis and Magneto-Structural Analysis in the Coupled-Field Analysis Guide. See also Electroelasticity and Magnetoelasticity in the Mechanical APDL Theory Reference.

KEYOPT(5)

Eddy or velocity currents in structural-electromagnetic (KEYOPT(1) = 10101) analyses:

0 -- 

Eddy and velocity currents are active

1 -- 

Eddy currents are suppressed, velocity currents are active

2 -- 

Velocity currents are suppressed, eddy currents are active

3 -- 

Eddy and velocity currents are suppressed

KEYOPT(7)

Electromagnetic force output (FMAG) location for coupled-field analyses with magnetic degrees of freedom:

0 -- 

At each element node (corner and midside)

1 -- 

At element corner nodes only (midside node forces are condensed to the corner nodes)


Note:  For analyses that include structural and magnetic degrees of freedom, KEYOPT(7) = 1 does not apply; electromagnetic force is always reported at each element node (corner and midside).


KEYOPT(8)

Electromagnetic force calculation in coupled-field analyses with magnetic degrees of freedom:

0 -- 

Maxwell

1 -- 

Lorentz


Note:  You cannot intermix the Maxwell and Lorentz force calculation options in adjacent magnetic domains. For more information, see Performing a Magneto-Structural Analysis in the Coupled-Field Analysis Guide.


KEYOPT(9)

Thermoelastic damping (piezocaloric effect) in coupled-field analyses having structural and thermal degrees of freedom.

0 -- 

Active. Evaluated at the reference temperature. Applicable to harmonic and transient analyses.

1 -- 

Suppressed (required for frictional heating analyses).

2 -- 

Active. Evaluated at the actual temperature. Applicable to a transient analysis.

KEYOPT(10)

Specific heat matrix in coupled-field analyses having the thermal degree of freedom (TEMP), or damping matrix in coupled-field analyses having the diffusion degree of freedom (CONC).

0 -- 

Consistent

1 -- 

Diagonalized

2 -- 

Diagonalized. Temperature-dependent specific heat or enthalpy is evaluated at the element centroid.

KEYOPT(11)

Element formulation in coupled-field analyses with structural degrees of freedom:

0 -- 

Pure displacement formulation (default)

1 -- 

Mixed u-P formulation (not valid with plane stress)

KEYOPT(15)

Perfectly matched layers (PML) absorbing condition in a harmonic piezoelectric analysis (KEYOPT(1) = 1001):

0 -- 

Do not include the PML absorbing condition (default)

1 -- 

Include the PML absorbing condition

Table 223.7: PLANE223 Real Constants

No.NameDescriptionDefaultDefinition
1THKThickness1Used with KEYOPT(3) = 3
The following real constants are for the structural-stranded coil analysis (KEYOPT(1) = 10201)
2SCCoil cross-sectional areanoneTrue physical cross-section of the coil regardless of symmetry modeling considerations. It includes the cross-sectional area of the wire and the non-conducting material filling the space between the winding.
3NCNumber of coil turns1Total number of winding turns in a coil regardless of any symmetry modeling considerations.
4RADMean radius of the coil (axisymmetric)noneMean radius of the axisymmetric coil model. If the mean radius is not known, input VC/((2π)(SC)) , where VC is the full symmetry true physical volume of the coil. VC includes the volume occupied by the wire and the non-conducting material filling the space between the winding.
5TZCurrent polarity

1 (plane)

-1 (axisymmetric)

The current flow direction (1 or -1) with respect to Z-axis
6RCoil resistancenoneTotal coil DC resistance regardless of any symmetry modeling considerations.
7SYMCoil symmetry factor 1Ratio of the full symmetry coil cross-sectional area (SC) to the modeled coil area. The input should be equal to or greater than 1.

PLANE223 Output Data

The solution output associated with the element is in two forms:

The element output directions are parallel to the element coordinate system. A general description of solution output is given in Solution Output. See the Basic Analysis Guide for ways to view results.

The Element Output Definitions table uses the following notation:

A colon (:) in the Name column indicates that the item can be accessed by the Component Name method (ETABLE, ESOL). The O column indicates the availability of the items in the file jobname.out. The R column indicates the availability of the items in the results file.

In either the O or R columns, “Y” indicates that the item is always available, a letter or number refers to a table footnote that describes when the item is conditionally available, and “-” indicates that the item is not available.

Table 223.8: PLANE223 Element Output Definitions

NameDefinitionOR
ALL ANALYSES
ELElement Number-Y
NODESNodes - I, J, K, L, M, N, O, P-Y
MATMaterial number-Y
VOLU:Volume-Y
XC, YCLocation where results are reported-2
ALL ANALYSES WITH A STRUCTURAL FIELD
THICKThickness-Y
S:X, Y, Z, XY [13]Stresses (SZ = 0.0 for plane stress elements)-1
S:1, 2, 3Principal stresses-1
S:EQVEquivalent stress-1
EPEL:X, Y, Z, XY [13]Elastic strains-1
EPTH:X, Y, Z, XY [13]Thermal strains-1
EPTH:EQVEquivalent thermal strain [3]-1
EPPL:X, Y, Z, XY [13]Plastic strains-1
EPPL:EQVEquivalent plastic strain [3]-1
EPCR:X, Y, Z, XY [13]Creep strains-1
EPCR:EQVEquivalent creep strain [3]-1
EPTO:X, Y, Z, XY [13]Total mechanical strains (EPEL + EPPL + EPCR)Y-
EPTO:EQVTotal equivalent mechanical strain (EPEL + EPPL + EPCR)--
EPTT:X, Y, Z, XY [13]Total mechanical, thermal, and diffusion strains (EPEL + EPPL + EPCR + EPTH + EPDI)--
EPTT:EQVTotal equivalent mechanical strain (EPEL + EPPL + EPCR + EPTH + EPDI)--
NL:SEPLPlastic yield stress [10]-Y
NL:EPEQAccumulated equivalent plastic strain [10]-Y
NL:CREQAccumulated equivalent creep strain [10]-Y
NL:SRATPlastic yielding (1 = actively yielding, 0 = not yielding) [10]-Y
NL:HPRESHydrostatic pressure [10]-Y
SENE:Elastic strain energy-Y
ADDITIONAL OUTPUT FOR STRUCTURAL-THERMAL ANALYSES (KEYOPT(1) = 11) [11]
TG:X, Y, SUMThermal gradient components and vector magnitude-1
TF:X, Y, SUMThermal flux components and vector magnitude-1
UEElastic strain energy [7]-1
UTTotal strain energy [8]-1
PHEAT Plastic heat generation rate per unit volume-1
VHEATViscoelastic heat generation rate per unit volume-1
ADDITIONAL OUTPUT FOR PIEZORESISTIVE ANALYSES (KEYOPT(1) = 101) [11]
TEMPInput temperatures-Y
EF:X, Y, SUMElectric field components (X, Y) and vector magnitude-1
JC:X, Y, SUMConduction current density components (X, Y) and vector magnitude-1
JS:X, Y, SUMCurrent density components (in the global Cartesian coordinate system) (X, Y) and vector magnitude [4]-1
JHEATJoule heat generation per unit volume [5]-1
ADDITIONAL OUTPUT FOR ELECTROSTATIC-STRUCTURAL ANALYSES (KEYOPT(1) = 1001) [11]
TEMPInput temperatures-Y
EF:X, Y, SUMElectric field components (X, Y) and vector magnitude-1
D:X, Y, SUMElectric flux density components (X, Y) and vector magnitude-1
FMAG:X, Y, SUMElectrostatic force components (X, Y) and vector magnitude-1
JS:X, Y, SUMElement current density components (X, Y, Z) in the global Cartesian coordinate system and vector magnitude [4] -1
JHEATJoule heat generation per unit volume [5], [6]-1
UE, UM, UDElastic, mutual, and dielectric energies [7]-1
SENESum of elastic and dielectric energies (UE+UD) [7]-1
DENEDamping energy [7]-1
KENEKinetic energy [7]-1
ADDITIONAL OUTPUT FOR PIEZOELECTRIC ANALYSES (KEYOPT(1) = 1001 and 101) [11]
TEMPInput temperatures-Y
EF:X, Y, SUMElectric field components (X, Y) and vector magnitude-1
D:X, Y, SUMElectric flux density components (X, Y) and vector magnitude; available only for charge-based analysis (KEYOPT(1) = 1001)-1
JC:X, Y, SUMConduction current density components (X, Y) and vector magnitude; available only for current-based analysis (KEYOPT(1) = 101)-1
JS:X, Y, SUMElement current density components (X, Y) in the global Cartesian coordinate system and vector magnitude [4]-1
JHEATJoule heat generation per unit volume [5], [6]-1
UE, UM, UDElastic, mutual, and dielectric energies [7]-1
UTTotal strain energy [8]-1
SENESum of elastic and dielectric energies (UE + UD) [7]-1
DENEDamping energy [7]-1
KENEKinetic energy [7]-1
P:X, Y, SUMElement Poynting vector components (X, Y) and vector magnitude [7]-1
THERMAL-ELECTRIC ANALYSES (KEYOPT(1) = 110)
TG:X, Y, SUMThermal gradient components and vector magnitude-1
TF:X, Y, SUMThermal flux components and vector magnitude-1
EF:X, Y, SUMElectric field components and vector magnitude -1
JC:X, Y, SUMConduction current density components and vector magnitude-1
JS:X, Y, SUMCurrent density components (in the global Cartesian coordinate system) and vector magnitude [4]-1
JHEATJoule heat generation per unit volume [5], [6]-1
ADDITIONAL OUTPUT FOR STRUCTURAL-THERMOELECTRIC ANALYSES (KEYOPT(1) = 111) [11]
TG:X, Y, SUMThermal gradient components and vector magnitude-1
TF:X, Y, SUMThermal flux components and vector magnitude-1
EF:X, Y, SUMElectric field components and vector magnitude-1
JC:X, Y, SUMConduction current density components and vector magnitude-1
JS:X, Y, SUMCurrent density components (in the global Cartesian coordinate system) and vector magnitude [4]-1
JHEATJoule heat generation per unit volume [5], [6]-1
UEElastic strain energy-1
UTTotal strain energy [8]-1
PHEAT Plastic heat generation rate per unit volume-1
VHEATViscoelastic heat generation rate per unit volume-1
ADDITIONAL OUTPUT FOR THERMAL-PIEZOELECTRIC ANALYSES (KEYOPT(1) = 1011) [11]
TG:X, Y, SUMThermal gradient components and vector magnitude-1
TF:X, Y, SUMThermal flux components and vector magnitude-1
EF:X, Y, SUMElectric field components and vector magnitude-1
D:X, Y, SUMElectric flux density components and vector magnitude-1
JHEATJoule heat generation per unit volume [5], [6]-1
UE, UM, UDElastic, mutual, and dielectric energies [7]-1
UTTotal strain energy [8]-1
PHEAT Plastic heat generation rate per unit volume-1
VHEATViscoelastic heat generation rate per unit volume-1
ADDITIONAL OUTPUT FOR STRUCTURAL-MAGNETIC ANALYSES (KEYOPT(1) = 10001) [11]
B: X, Y, SUMMagnetic flux density components and vector magnitude-1
H: X, Y, SUMMagnetic field intensity components and vector magnitude-1
FMAG: X, Y, SUMElectromagnetic force components and magnitude-1
JT: Z, SUMElement conduction current density components (in the global Cartesian coordinate system) and vector magnitude-1
JHEATJoule heat generation rate per unit volume [5], [6]-1
UEElastic strain energy-1
UMAGMagnetic energy-1
COENMagnetic co-energy-1
ADDITIONAL OUTPUT FOR STRUCTURAL-ELECTROMAGNETIC ANALYSES (KEYOPT(1) = 10101) [11]
B: X, Y, SUMMagnetic flux density components and vector magnitude-1
H: X, Y, SUMMagnetic field intensity components and vector magnitude-1
EF: Z, SUMElectric field intensity components and magnitude-1
JC: Z, SUMNodal conduction current density components and magnitude-1
FMAG: X, Y, SUMElectromagnetic force components and magnitude-1
JT: Z, SUMElement conduction current density components (in the global Cartesian coordinate system) and vector magnitude-1
JS: Z, SUMElement current density components (in the global Cartesian coordinate system) and vector magnitude [4]-1
JHEATJoule heat generation rate per unit volume [5], [6]-1
UEElastic strain energy-1
UMAGMagnetic energy-1
COENMagnetic co-energy-1
ADDITIONAL OUTPUT FOR STRUCTURAL-STRANDED COIL ANALYSES (KEYOPT(1) = 10201) [11]
B: X, Y, SUMMagnetic flux density components and vector magnitude-1
H: X, Y, SUMMagnetic field intensity components and vector magnitude-1
FMAG: X, Y, SUMElectromagnetic force components and magnitude-1
JT: Z, SUMElement conduction current density components (in the global Cartesian coordinate system) and vector magnitude [12]-1
JS: Z, SUMElement current density components (in the global Cartesian coordinate system) and vector magnitude [4], [12]-1
JHEATJoule heat generation rate per unit volume [5], [6], [12]-1
UEElastic strain energy-1
UMAGMagnetic energy-1
COENMagnetic co-energy-1
THERMAL-MAGNETIC ANALYSES (KEYOPT(1) = 10010)
TG:X, Y, SUMThermal gradient components and vector magnitude-1
TF:X, Y, SUMThermal flux components and vector magnitude-1
B:X, Y, SUMMagnetic flux density components and vector magnitude-1
H:X, Y, SUMMagnetic field intensity components and vector magnitude-1
FMAG:X, Y, SUMElectromagnetic force components and magnitude-1
JT:Z, SUMConduction current density Z component (in the global Cartesian coordinate system) and vector magnitude-1
JHEATJoule heat generation per unit volume -1
THERMAL-ELECTROMAGNETIC ANALYSES (KEYOPT(1) = 10110)
TG:X, Y, SUMThermal gradient components and vector magnitude-1
TF:X, Y, SUMThermal flux components and vector magnitude-1
EF:Z, SUMElectric field intensity Z component and vector magnitude-1
JC:Z, SUMConduction current density Z component and vector magnitude-1
B:X, Y, SUMMagnetic flux density components and vector magnitude-1
H:X, Y, SUMMagnetic field intensity components and vector magnitude-1
FMAG:X, Y, SUMElectromagnetic force components and magnitude-1
JT:Z, SUMConduction current density Z component (in the global Cartesian coordinate system) and vector magnitude-1
JS:Z, SUMCurrent density Z component (in the global Cartesian coordinate system) and vector magnitude [4]-1
JHEATJoule heat generation per unit volume -1
ADDITIONAL OUTPUT FOR STRUCTURAL-DIFFUSION ANALYSES (KEYOPT(1) = 100001) [11]
TEMPInput temperatures-Y
EPDI:X, Y, Z, XYDiffusion strains-1
CG:X, Y, SUMConcentration gradient components and vector magnitude-1
DF:X, Y, SUMDiffusion flux components and vector magnitude-1
CONCElement concentration [9]-1
DFC:X,Y,SUMPure diffusion flux components (X,Y) and vector magnitude -1
DFS:X,Y,SUMStress migration flux components (X,Y) and vector magnitude -1
THERMAL-DIFFUSION ANALYSES (KEYOPT(1) = 100010)
TG:X, Y, SUMThermal gradient components and vector magnitude-1
TF:X, Y, SUMThermal flux components and vector magnitude-1
CG:X, Y, SUMConcentration gradient components and vector magnitude-1
DF:X, Y, SUMDiffusion flux components and vector magnitude-1
CONCElement concentration [9]-1
DFC:X,Y,SUMPure diffusion flux components (X,Y) and vector magnitude -1
DFT:X,Y,SUMThermal migration flux components (X,Y) and vector magnitude -1
ELECTRIC-DIFFUSION ANALYSES (KEYOPT(1) = 100100)
TEMPInput temperatures-Y
EF:X, Y, SUMElectric field components and vector magnitude-1
JC:X, Y, SUMConduction current density components and vector magnitude-1
JS:X, Y, SUMCurrent density components (in the global Cartesian coordinate system) and vector magnitude [4]-1
CG:X, Y, SUMConcentration gradient components and vector magnitude-1
DF:X, Y, SUMDiffusion flux components and vector magnitude-1
CONCElement concentration [9]-1
DFC:X,Y,SUMPure diffusion flux components (X,Y) and vector magnitude -1
DFE:X,Y,SUMElectric migration flux components (X,Y) and vector magnitude -1
THERMAL-ELECTRIC-DIFFUSION ANALYSES (KEYOPT(1) = 100110)
TG:X, Y, SUMThermal gradient components and vector magnitude-1
TF:X, Y, SUMThermal flux components and vector magnitude-1
EF:X, Y, SUMElectric field components and vector magnitude-1
JC:X, Y, SUMConduction current density components and vector magnitude-1
JS:X, Y, SUMCurrent density components (in the global Cartesian coordinate system) and vector magnitude [4]-1
JHEATJoule heat generation per unit volume [5], [6]-1
CG:X, Y, SUMConcentration gradient components and vector magnitude-1
DF:X, Y, SUMDiffusion flux components and vector magnitude-1
CONCElement concentration [9]-1
DFC:X,Y,SUMPure diffusion flux components (X,Y) and vector magnitude-1
DFT:X,Y,SUMThermal migration flux components (X,Y) and vector magnitude -1
DFE:X,Y,SUMElectric migration flux components (X,Y) and vector magnitude -1
ADDITIONAL OUTPUT FOR STRUCTURAL-ELECTRIC-DIFFUSION ANALYSES (KEYOPT(1) = 100101) [11]
TEMPInput temperatures-Y
EPDI:X, Y, Z, XYDiffusion strains-1
EF:X, Y, SUMElectric field components and vector magnitude-1
JC:X, Y, SUMConduction current density components and vector magnitude-1
JS:X, Y, SUMConduction current density components and vector magnitude-1
JHEATJoule heat generation per unit volume [5], [6]-1
CG:X, Y, SUMConcentration gradient components and vector magnitude-1
DF:X, Y, SUMDiffusion flux components and vector magnitude-1
CONCElement concentration [9]-1
DFC:X,Y,SUMPure diffusion flux components (X,Y) and vector magnitude-1
DFS:X,Y,SUMStress migration flux components (X,Y) and vector magnitude -1
DFE:X,Y,SUMElectric migration flux components (X,Y) and vector magnitude -1
ADDITIONAL OUTPUT FOR STRUCTURAL-THERMAL-DIFFUSION ANALYSES (KEYOPT(1) = 100011) [11]
EPDI:X, Y, Z, XYDiffusion strains-1
TG:X, Y, SUMThermal gradient components and vector magnitude-1
TF:X, Y, SUMThermal flux components and vector magnitude-1
CG:X, Y, SUMConcentration gradient components and vector magnitude-1
DF:X, Y, SUMDiffusion flux components and vector magnitude-1
CONCElement concentration [9]-1
DFC:X,Y,SUMPure diffusion flux components (X,Y) and vector magnitude -1
DFS:X,Y,SUMStress migration flux components (X,Y) and vector magnitude -1
DFT:X,Y,SUMThermal migration flux components (X,Y) and vector magnitude -1
PHEAT Plastic heat generation rate per unit volume-1
VHEATViscoelastic heat generation rate per unit volume-1
ADDITIONAL OUTPUT FOR STRUCTURAL-THERMAL-ELECTRIC-DIFFUSION ANALYSES (KEYOPT(1) = 100111) [11]
EPDI:X, Y, Z, XYDiffusion strains-1
TF:X, Y, SUMThermal flux components and vector magnitude-1
EF:X, Y, SUMElectric field components and vector magnitude-1
JC:X, Y, SUMConduction current density components and vector magnitude-1
JS:X, Y, SUMConduction current density components and vector magnitude-1
JHEATJoule heat generation per unit volume [5], [6]-1
CG:X, Y, SUMConcentration gradient components and vector magnitude-1
DF:X, Y, SUMDiffusion flux components and vector magnitude-1
CONCElement concentration [9]-1
DFC:X,Y,SUMPure diffusion flux components (X,Y) and vector magnitude -1
DFS:X,Y,SUMStress migration flux components (X,Y) and vector magnitude -1
DFT:X,Y,SUMThermal migration flux components (X,Y) and vector magnitude -1
DFE:X,Y,SUMElectric migration flux components (X,Y) and vector magnitude -1
PHEAT Plastic heat generation rate per unit volume-1
VHEATViscoelastic heat generation rate per unit volume-1

  1. Solution values are output only if calculated (based on input values).

  2. Available only at centroid as a *GET item.

  3. The equivalent strains use an effective Poisson's ratio: for elastic and thermal this value is set by the user (MP,PRXY); for plastic and creep this value is set at 0.5.

  4. JS represents the sum of element conduction and displacement current densities.

  5. Calculated Joule heat generation rate per unit volume (JHEAT) may be made available for a subsequent thermal analysis with companion thermal elements. For piezoelectric and electrostatic-structural analyses, the heat generation rate output as JHEAT is produced by both the supported structural and electrical losses.

  6. For a time-harmonic analysis, Joule losses (JHEAT) are time-averaged. These values are stored in both the real and imaginary data sets. For more information, see Quasistatic Electric Analysis in the Mechanical APDL Theory Reference.

  7. For time-harmonic and modal analyses, the following values are time-averaged: elastic (UE), mutual (UM), and dielectric (UD) energies, the sum of elastic and dielectric energies (SENE), damping energy (DENE), kinetic energy (KENE), and the Poynting vector (P). The real part of the UE, UM, UD, and SENE records represents the average energy, while the imaginary part represents the average energy loss. The real part of the Poynting vector represents the average power flow. For more information, see Piezoelectrics and Electroelasticity in the Mechanical APDL Theory Reference.

  8. For a time-harmonic analysis, total strain (UT) energy is time-averaged. The real part represents the average energy, while the imaginary part represents the average energy loss. For more information, see Thermoelasticity in the Mechanical APDL Theory Reference.

  9. With the normalized concentration approach, CONC is the actual concentration obtained by multiplying the saturated concentration (MP,CSAT) and the normalized concentration evaluated at the element centroid. For more information, see Normalized Concentration Approach in the Theory Reference.

  10. Nonlinear solution, output only if the element has a nonlinear material, or if large-deflection effects are enabled (NLGEOM,ON).

  11. Output listed for this coupled analysis is in addition to the structural field output at the beginning of this table.

  12. For the structural-stranded coil analysis option (KEYOPT(1) = 10201), JT and JS are the effective current densities as they are calculated based on the coil cross-sectional area (SC) that includes the wire and the non-conducting material filling the space between the winding. JHEAT represents the effective Joule heat generation rate per unit volume as it is calculated based on the modeled coil volume that includes the wire and the non-conducting material filling the space between the winding.

  13. Also YZ and XZ when used with the axisymmetric with torsion option (KEYOPT(3) = 6). Stress/strain outputs have six components with the same meanings as the 3D solid element outputs. To better understand the solution results, you can plot them in 3D space (/ESHAPE,1) when PowerGraphics is enabled (/GRAPHICS,POWER).

Table 223.9: PLANE223 Item and Sequence Numbers lists output available via ETABLE using the Sequence Number method. See The General Postprocessor (POST1) of the Basic Analysis Guide and The Item and Sequence Number Table in this reference for more information. The following notation is used in Table 223.9: PLANE223 Item and Sequence Numbers:

Name

output quantity as defined in the Table 223.8: PLANE223 Element Output Definitions

Item

predetermined Item label for ETABLE command

E

sequence number for single-valued or constant element data

Table 223.9: PLANE223 Item and Sequence Numbers

Output Quantity NameETABLE Command Input
ItemE
Analyses that include DIFFUSION (KEYOPT(1) = 100001, 100010, 100100, 100110, 100011, 100101, and 100111)
CONCSMISC1
DFCXSMISC2
DFCYSMISC3
DFCSUMSMISC5
DFSXSMISC6
DFSYSMISC7
DFSSUMSMISC9
DFTXSMISC10
DFTYSMISC11
DFTSUMSMISC13
DFEXSMISC14
DFEYSMISC15
DFESUMSMISC17
STRUCTURAL-THERMAL ANALYSES (KEYOPT(1) = 11)
UENMISC1
UTNMISC4
PHEATNMISC5
VHEATNMISC6
ELECTROSTATIC-STRUCTURAL ANALYSES (KEYOPT(1) = 1001)
UENMISC1
UDNMISC2
UMNMISC3
PIEZOELECTRIC ANALYSES (KEYOPT(1) = 1001 and 101)
UENMISC1
UDNMISC2
UMNMISC3
UTNMISC4
PXNMISC5
PYNMISC6
PSUMNMISC8
STRUCTURAL-THERMOELECTRIC ANALYSES (KEYOPT(1) = 111)
UTNMISC4
PHEATNMISC5
VHEATNMISC6
THERMAL-PIEZOELECTRIC ANALYSES (KEYOPT(1) = 1011)
UENMISC1
UDNMISC2
UMNMISC3
UTNMISC4
PHEATNMISC5
VHEATNMISC6
STRUCTURAL-MAGNETIC ANALYSES (KEYOPT(1) = 10001)
STRUCTURAL-ELECTROMAGNETIC ANALYSES (KEYOPT(1) = 10101)
STRUCTURAL-STRANDED COIL ANALYSES (KEYOPT(1) = 10201)
UENMISC1
UMAGNMISC2
JTZNMISC6
THERMAL-MAGNETIC ANALYSES (KEYOPT(1) = 10010)
THERMAL-ELECTROMAGNETIC ANALYSES (KEYOPT(1) = 10110)
JTZNMISC1
STRUCTURAL-THERMAL-DIFFUSION ANALYSES (KEYOPT(1) = 100011)
STRUCTURAL-THERMAL-ELECTRIC-DIFFUSION ANALYSES (KEYOPT(1) = 100111)
PHEATNMISC5
VHEATNMISC6
Analyses that include a STRUCTURAL field
(KEYOPT(1) = 11, 111, 1001, 10001, 10101, 10201, 100001, 100011, 100101, and 100111)
THICKNMISC9

PLANE223 Assumptions and Restrictions

  • The element assumes a unit thickness for plane strain (KEYOPT(3) = 2) calculations.

  • In a piezoelectric or electrostatic-structural analysis, electric charge loading is interpreted as negative electric charge or negative charge density.

  • In a coupled-field analysis with structural degrees of freedom, the model should have at least two elements in each direction to avoid the hourglass mode.

  • Optimized nonlinear solution defaults are applied in coupled-field analyses with structural degrees of freedom using this element.

  • The element must lie in a global X-Y plane as shown in Figure 223.1: PLANE223 Geometry and the Y-axis must be the axis of symmetry for axisymmetric analyses.

  • An axisymmetric structure should be modeled in the +X quadrants.

  • A face with a removed midside node implies that the degrees-of-freedom vary linearly, rather than parabolically, along that face. See Quadratic Elements (Midside Nodes) in the Modeling and Meshing Guide for more information about the use of midside nodes.

  • In an analysis with structural and diffusion degrees of freedom coupled by the stress migration effect (specified using TB,MIGR), the following are not supported:

    • Removing midside nodes

    • The weak coupling option (KEYOPT(2) = 1)

  • In a coupled-field electromagnetic analysis, all VOLT degrees of freedom must be coupled (CP).

  • For a structural-stranded coil analysis (KEYOPT(1) = 10201), all VOLT and EMF degrees of freedom must be coupled (CP).

  • This element may not be compatible with other elements with the VOLT degree of freedom. To be compatible, the elements must have the same reaction solution for the VOLT degree of freedom. Elements that have an electric charge reaction solution must all have the same electric charge reaction sign. For more information, see Element Compatibility in the Low-Frequency Electromagnetic Analysis Guide.

  • When a coupled-field analysis with structural degrees of freedom uses mixed u-P formulation (KEYOPT(11) = 1), no midside nodes can be dropped. When using mixed formulation (KEYOPT(11) = 1), use the sparse solver (default).

  • Stress stiffening is always included in geometrically nonlinear (NLGEOM,ON) coupled-field analyses with structural degrees of freedom. Prestress effects can be activated via the PSTRES command.

  • Graphical Solution Tracking (/GST) is not supported for the analyses with CONC DOFs (KEYOPT(1) = 100001, 100010, and 100011, 100100, 100101, 100110, and 100111).

  • Reaction forces are not available for electrostatic-structural (KEYOPT(1) = 1001) or magneto-structural (KEYOPT(1) = 10001) analyses with the elastic air option (KEYOPT(4) = 1).

  • The weak coupling option (KEYOPT(2) = 1) is not recommended in a transient coupled-electromagnetic analysis with eddy currents or in a transient stranded coil analysis because multiple iterations may be required to achieve convergence.

  • In a plane stress piezoelectric analysis (KEYOPT(1) = 1001 and KEYOPT(3) = 0) with anisotropic structural damping (TB,AVIS or TB,ELST), the plane stress state is approximated by setting both the elastic and viscous (or imaginary) components of out-of-plane stress to zero.

  • The following are true for the axisymmetric with torsion option (KEYOPT(3) = 6):

    • It can be used only with surface element SURF153 with KEYOPT(3) = 1.

    • Rezoning and nonlinear adaptivity are not supported.

    • Results of analyses using the axisymmetric with torsion option can be displayed using the /ESHAPE command.

  • Tabular thickness input (KEYOPT(3) = 3) is supported only when structural degrees of freedom are present within the element.

  • The film coefficient (if any) is evaluated at average film temperature (TS + TB)/2 for the coupled-thermal analyses (KEYOPT(1) = 11, 110, 111, 1011, 100010, 100110, 100011, and 100111).

PLANE223 Product Restrictions

There are no product-specific restrictions for this element.