ETABLE

ETABLE, Lab, Item, Comp, Option
Fills a table of element values for further processing.

POST1: Element Table

Lab

Any unique user-defined label for use in subsequent commands and output headings. A valid label has a maximum of eight characters and is not a general predefined Item label. Default: An eight-character label formed by concatenating the first four characters of the Item and Comp labels.

If the same as a previous user label, the result item is included under the same label. Up to 200 different labels can be defined.

The following predefined labels are reserved:

REFL	—	Refills all tables previously defined with the ETABLE commands (not the CALC module commands) according to the latest ETABLE specifications. It is convenient for refilling tables after the load step (SET) has changed. Remaining fields are ignored.
STAT	—	Displays stored table values.
ERAS	—	Erases the entire table.

Item

Label identifying the item. General item labels are shown in the tables below. Some items also require a component label. Character parameters are valid. Item = ERAS erases a Lab column. For selected result output, specify SRES and see Table 114: ETABLE - Selected Result (SRES) Component Labels.

Comp

Component of the item (if required). General component labels are shown in the tables below. Character parameters can be used.

Option

Option for storing element table data:

MIN	—	Store minimum element nodal value of the specified item component.
MAX	—	Store maximum element nodal value of the specified item component.
AVG	—	Store averaged element centroid value of the specified item component (default).

Notes

ETABLE defines a table of values per element (the element table) for use in further processing. The element table is organized similar to a spreadsheet, with rows representing all selected elements and columns consisting of result items which have been moved into the table (Item,Comp) via ETABLE. Each column of data is identified by a user-defined label (Lab) for listings and displays.

After entering the data into the element table, you are not limited to listing or displaying your data (PLESOL, PRESOL, etc.). You can also perform many types of operations on your data, such as adding or multiplying columns (SADD, SMULT), defining allowable stresses for safety calculations (SALLOW), or multiplying one column by another (SMULT). For more information, see Getting Started in the Basic Analysis Guide.

For reinforcing elements, this command displays the results of reinforcing member (individual reinforcing) selected via the LAYER,N command (where N is a given reinforcing member). LAYER,0 (default) or LAYER,1 selects the first reinforcing member.

Various results data can be stored in the element table. For example, many items for an element are inherently single-valued (one value per element). The single-valued items include: SERR, SDSG, TERR, TDSG, SENE, TENE, KENE, ASENE, PSENE, AKENE, PKENE, DENE, WEXT, AENE, JHEAT, JS, VOLU, and CENT. All other items are multivalued (varying over the element, such that there is a different value at each node). Because only one value is stored in the element table per element, an average value (based on the number of contributing nodes) is calculated for multivalued items. Exceptions to this averaging procedure are FMAG and all element force items, which represent the sum only of the contributing nodal values.

Two methods of data access can be used with the ETABLE command. The method you select depends upon the type of data that you want to store. Some results can be accessed via a generic label (Component Name method), while others require a label and number (Sequence Number method).

The component name method is used to access the general element data (that is, element data which is generally available to most element types or groups of element types). All of the single-valued items and some of the more general multivalued items are accessible with the Component Name method. Various element results depend on the calculation method and the selected results location (AVPRIN, RSYS, LAYER, SHELL, and ESEL).

Although nodal data is readily available for listing and display (PRNSOL, PLNSOL) without using the element table, you can also use the Component Name method to enter these results into the element table for further "worksheet" manipulation. (See Getting Started in the Basic Analysis Guide for more information.) A listing of the general Item and Comp labels for the component name method is shown in Table 113: ETABLE - General Result Item and Component Labels. See Table 114: ETABLE - Selected Result (SRES) Component Labels for a list of selected result (Item = SRES) Comp labels.

The sequence number method enables you to view results for data that is not averaged (such as pressures at nodes, temperatures at integration points, etc.), or data that is not easily described in a generic fashion (such as all derived data for structural line elements and contact elements, all derived data for thermal line elements, layer data for layered elements, etc.). A table illustrating the Items (such as LS, LEPEL, LEPTH, SMISC, NMISC, SURF, etc.) and corresponding sequence numbers for each element is shown in the Output Data section of each element description.

Some element table data are reported in the results coordinate system. These include all component results (for example, UX, UY, etc.; SX, SY, etc.). Line element solution quantities (LS, LEPEL, LEPTH, LEPPL, LEPCR, LEPTO, and LEPTT) for ELBOW290 are also reported in the results coordinate system if euler angles are saved. The solution writes component results in the database and on the results file in the solution coordinate system. When you issue the ETABLE command, these results are then transformed into the results coordinate system (RSYS) before being stored in the element table. The default results coordinate system is global Cartesian (RSYS,0). All other data are retrieved from the database and stored in the element table with no coordinate transformation.

To display the stored table values, issue the PRETAB, PLETAB, or ETABLE,STAT command. To erase the entire table, issue ETABLE,ERAS. To erase a Lab column, issue ETABLE,Lab,ERAS.

When the GUI is enabled, if a Delete operation in a Define Element Table Data dialog box writes this command to a log file (Jobname.log or Jobname.lgw), the program sets Lab = blank, Item = ERASE, and Comp = an integer number. In this case, the program has assigned a value of Comp that corresponds to the location of a chosen variable name in the dialog list. It is not intended that you type in such a location value for Comp in a session; however, a file that contains a GUI-generated ETABLE command of this form can be used for batch input or the /INPUT command.

The MIN and MAX options are not available for thermal elements.

The element table data option (Option) is not available for all output items. See the table below for supported items.

Table 113: ETABLE - General Result Item and Component Labels

General Item and Component Labels ETABLE, Lab, Item, Comp

Item Comp Description

Valid Item Labels for Degree of Freedom Results

U X, Y, Z X, Y, or Z structural displacement.

ROT X, Y, Z X, Y, or Z structural rotation.

TEMP^[a] Temperature.

PRES Pressure.

VOLT Electric potential.

GFV1, GFV2, GFV3 Nonlocal field values 1, 2, and 3.

MAG Magnetic scalar potential.

V X, Y, Z X, Y, or Z fluid velocity.

A X, Y, Z X, Y, or Z magnetic vector potential.

CONC Concentration.

CURR Current.

EMF Electromotive force drop.

Valid Item and Component Labels for Element Results

S^[b] X, Y, Z, XY, YZ, XZ Component stress.

1, 2, 3 Principal stress.

INT Stress intensity.

EQV Equivalent stress.

EPEL^[b] X, Y, Z, XY, YZ, XZ Component elastic strain.

1, 2, 3 Principal elastic strain.

INT Elastic strain intensity.

EQV Elastic equivalent strain.

EPTH^[b] X, Y, Z, XY, YZ, XZ Component thermal strain.

1, 2, 3 Principal thermal strain.

INT Thermal strain intensity.

EQV Thermal equivalent strain.

EPDI^[b] X, Y, Z, XY, YZ, XZ Component diffusion strain.

1, 2, 3 Principal diffusion strain.

EQV Diffusion equivalent strain.

INT Diffusion strain intensity.

EPPL^[b] X, Y, Z, XY, YZ, XZ Component plastic strain.

1, 2, 3 Principal plastic strain.

INT Plastic strain intensity.

EQV Plastic equivalent strain.

EPCR^[b] X, Y, Z, XY, YZ, XZ Component creep strain.

1, 2, 3 Principal creep strain.

INT Creep strain intensity.

EQV Creep equivalent strain.

EPSW^[b] Swelling strain.

EPTO^[b] X, Y, Z, XY, YZ, XZ Component total mechanical strain (excluding thermal) (EPEL + EPPL + EPCR).

1, 2, 3 Principal total mechanical strain.

INT Total mechanical strain intensity.

EQV Total equivalent mechanical strain.

EPTT^[b] X, Y, Z, XY, YZ, XZ Component total strain including thermal, diffusion, and swelling (EPEL + EPTH + EPPL + EPDI + EPCR + EPSW).

1, 2, 3 Principal total strain.

INT Total strain intensity.

EQV Total equivalent strain.

NL^[b] SEPL Equivalent stress (from stress-strain curve).

SRAT Stress state ratio.

HPRES Hydrostatic pressure.

EPEQ Accumulated equivalent plastic strain.

CREQ Accumulated equivalent creep strain.

PSV Plastic state variable.

PLWK Plastic work/volume.

SEND^[b] ELASTIC^[c] Elastic strain energy density. (For viscoelastic and sintering materials, the stored energy.)

PLASTIC Plastic strain energy density.

CREEP Creep strain energy density.

DAMAGE Damage strain energy density.

VDAM^[c] Viscoelastic dissipation energy density.

VREG Visco-regularization strain energy density.

DISS Structural-thermal dissipation.

ENTO Total strain energy density (sum of ELASTIC, PLASTIC, and CREEP strain energy densities).

SVAR 1 to MAX State variable.

CDM DMG Damage variable.

LM Maximum previous strain energy for virgin material.

FAIL MAX^[a]^[d] Maximum of all active failure criteria defined at the current location (FCTYP) .

EMAX^[a]^[d] Maximum Strain Failure Criterion.

SMAX^[a]^[d] Maximum Stress Failure Criterion.

TWSI^[a]^[d] Tsai-Wu Strength Index Failure Criterion.

TWSR^[a]^[d] Inverse of Tsai-Wu Strength Ratio Index Failure Criterion.

HFIB^[a]^[d]^[e] Hashin Fiber Failure Criterion.

HMAT^[a]^[d]^[e] Hashin Matrix Failure Criterion.

PFIB^[a]^[d]^[e] Puck Fiber Failure Criterion.

PMAT^[a]^[d]^[e] Puck Matrix Failure Criterion.

L3FB^[a]^[d]^[e] LaRc03 Fiber Failure Criterion.

L3MT^[a]^[d]^[e] LaRc03 Matrix Failure Criterion.

L4FB^[a]^[d]^[e] LaRc04 Fiber Failure Criterion.

L4MT^[a]^[d]^[e] LaRc04 Matrix Failure Criterion.

USR1, USR2, ..., USR9^[a]^[d]^[e]^[f] User-defined failure criteria.

PFC MAX^[g] Maximum of all failure criteria defined at current location.

FT^[g] Fiber tensile failure criteria.

FC^[g] Fiber compressive failure criteria.

MT^[g] Matrix tensile failure criteria.

MC^[g] Matrix compressive failure criteria.

PDMG STAT Damage status (0 = undamaged, 1 = damaged, 2 = completely damaged).

FT Fiber tensile damage variable.

FC Fiber compressive damage variable .

MT Matrix tensile damage variable .

MC Matrix compressive damage variable .

S Shear damage variable (S).

SED Energy dissipated per unit volume .

SEDV Energy per unit volume due to viscous damping.

FCMX^[a]^[d] LAY Layer number where the maximum of all active failure criteria over the entire element occurs.

Number of the maximum-failure criterion over the entire element:

1 - EMAX

2 - SMAX

3 - TWSI

4 - TWSR

5 - PFIB

6 - PMAT

7 - HFIB

8 - HMAT

9 - L3FB

10 - L3MT

11 - L4FB

12 - L4MT

13~21 - USR1~USR9

VAL Value of the maximum failure criterion over the entire element.

TG^[h] X, Y, Z, SUM Component thermal gradient or vector sum.

TF^[h] X, Y, Z, SUM Component thermal flux or vector sum.

PG X, Y, Z, SUM Component pressure gradient or vector sum.

EF X, Y, Z, SUM Component electric field or vector sum.

D X, Y, Z, SUM Component electric flux density or vector sum.

H X, Y, Z, SUM Component magnetic field intensity or vector sum.

B X, Y, Z, SUM Component magnetic flux density or vector sum.

CG X, Y, Z, SUM Component concentration gradient or vector sum.

DF X, Y, Z, SUM Component diffusion flux density or vector sum.

FMAG^[f] X, Y, Z, SUM Component electromagnetic forces or vector sum.

SERR^[e] Structural error energy.

SDSG^[e] Absolute value of maximum variation of any nodal stress component.

TERR^[e] Thermal error energy.

TDSG^[e] Absolute value of the maximum variation of any nodal thermal gradient component.

F X, Y, Z Component structural force. Sum of element nodal values.

M X, Y, Z Component structural moment. Sum of element nodal values.

HEAT Heat flow. Sum of element nodal values.

FLOW Fluid flow. Sum of element nodal values.

AMPS Current flow. Sum of element nodal values.

FLUX Magnetic flux. Sum of element nodal values.

CSG X, Y, Z Component magnetic current segment.

RATE Diffusion flow rate. Sum of element nodal values.

SENE "Stiffness" energy or thermal heat dissipation (applies to all elements where meaningful). Same as TENE.

AENE Artificial energy of the element. This includes the sum of hourglass control energy and energy generated by in-plane drilling stiffness from shell elements (applies to all elements where meaningful). It also includes artificial energy due to contact stabilization. The energy is used for comparisons to SENE energy to predict the solution error due to artificial stiffness.

TENE Thermal heat dissipation or "stiffness" energy (applies to all elements where meaningful). Same as SENE.

KENE Kinetic energy (applies to all elements where meaningful).

ASENE Amplitude "stiffness" energy.

PSENE Peak "stiffness" energy.

AKENE Amplitude kinetic energy.

PKENE Peak kinetic energy.

DENE Damping energy.

WEXT^[i] Work due to external load.

STEN Elemental energy dissipation due to stabilization.

JHEAT Element Joule heat generation.

JS X, Y, Z, SUM Source current density for low-frequency magnetic analyses. Total current density (sum of conduction and displacement current densities) in low frequency electric analyses. Components (X, Y, Z) and vector sum (SUM).

JT X, Y, Z, SUM Total measureable current density in low-frequency electromagnetic analyses. (Conduction current density in a low-frequency electric analysis.) Components (X, Y, Z) and vector sum (SUM).

JC X, Y, Z, SUM Conduction current density for elements that support conduction current calculation. Components (X, Y, Z) and vector sum (SUM).

MRE Magnetics Reynolds number.

VOLU Element volume. Based on unit thickness for 2D plane elements (unless the thickness option is used) and on the full 360 degrees for 2D axisymmetric elements.

CENT X, Y, Z Undeformed X, Y, or Z location (based on shape function) of the element centroid in the active coordinate system.

BFE^[b] TEMP Body temperatures (calculated from applied temperatures) as used in solution (area and volume elements only).

SMISC snum Element summable miscellaneous data value at sequence number snum (shown in the Output Data section of each applicable element description).

NMISC snum Element non-summable miscellaneous data value at sequence number snum (shown in the Output Data section of each applicable element description).

SURF snum Element surface data value at sequence number snum.

CONT

STAT^[d]

Contact status:

3 = closed and sticking

2 = closed and sliding

1 = open but near contact

0 = open and not near contact

PENE Contact penetration (zero or positive).

PRES Contact pressure.

SFRIC Contact friction stress.

STOT Contact total stress (pressure plus friction).

SLIDE Contact sliding distance.

GAP Contact gap distance (0 or negative).

FLUX Total heat flux at contact surface.

CNOS Total number of contact status changes during substep.

FPRS Fluid penetration pressure.

TOPO Densities used for topological optimization.

CAP C0,X0,K0,ZONE, DPLS,VPLS Material cap plasticity model only: Cohesion; hydrostatic compaction yielding stress; I1 at the transition point at which the shear and compaction envelopes intersect; zone = 0: elastic state, zone = 1: compaction zone, zone = 2: shear zone, zone = 3: expansion zone; effective deviatoric plastic strain; volume plastic strain.

EDPC CSIG,CSTR Material EDP creep model only (not including the cap model): Equivalent creep stress; equivalent creep strain.

ESIG^[b] X,Y,Z,XY,YZ,ZX Components of Biot’s effective stress.

1, 2, 3 Principal stresses of Biot’s effective stress.

INT Stress intensity of Biot’s effective stress.

EQV Equivalent stress of Biot’s effective stress.

DPAR TPOR Total porosity (Gurson material model).

GPOR Porosity due to void growth.

NPOR Porosity due to void nucleation.

FFLX X,Y,Z Fluid flow flux in poromechanics.

FGRA X,Y,Z Fluid pore pressure gradient in poromechanics.

FICT^[b] TEMP Fictive temperature.

PMSV VRAT, PPRE, DSAT, RPER Void volume ratio, pore pressure, degree of saturation, and relative permeability for coupled pore-pressure-thermal elements.

YSIDX TENS,SHEA Yield surface activity status for Mohr-Coulomb, soil, concrete, and joint rock material models: 1 = yielded, 0 = not yielded.

FPIDX TF01,SF01, TF02,SF02, TF03,SF03, TF04,SF04 Failure plane surface activity status for concrete and joint rock material models: 1 = yielded, 0 = not yielded. Tension and shear failure status are available for all four sets of failure planes.

NS X, Y, Z, XY, YZ, XZ Nominal strain for hyperelastic material, reported in the current configuration (unaffected by RSYS).

MPLA DMAC, DMAX Microplane damage, macroscopic and maximum values.

MPDP TOTA, TENS, COMP, RW Microplane homogenized total, tension, and compression damages (TOTA, TENS, COMP), and split weight factor (RW).

DAMAGE 1,2,3,MAX Damage in directions 1, 2, 3 (1, 2, 3) and the maximum damage (MAX).

GDMG Damage

IDIS Structural-thermal dissipation rate

BKS X, Y, Z, XY, YZ, XZ Total nonlinear kinematic backstress reported in the current configuration (unaffected by RSYS). Available for 3D, plane strain, and axisymmetric elements.

BKS1, . . . , BKS5 X, Y, Z, XY, YZ, XZ Superimposed components of the total nonlinear kinematic backstress reported in the current configuration (unaffected by RSYS). Available for 3D, plane strain, and axisymmetric elements when more than one superimposed back-stress component is defined.

EPFR Free strain in porous media

FC1S 1,2,3,4,5,6 First set of six components of FCC crystal slip. Available for 3D elements only.

FC2S 1,2,3,4,5,6 Second set of six components of FCC crystal slip. Available for 3D elements only.

HC1S 1,2,3,4,5,6 Six components of HCP crystal slip on basal and prismatic systems. Available for 3D elements only.

HC2S 1,2,3,4,5,6 Six components of HCP crystal slip on pyramidal system. Available for 3D elements only.

HC3S 1,2,3,4,5,6 First set of six components of HCP crystal slip on the first-order pyramidal system. Available for 3D elements only.

HC4S 1,2,3,4,5,6 Second set of six components of HCP crystal slip on the first-order pyramidal system. Available for 3D elements only.

HC5S 1,2,3,4,5,6 Six components of HCP crystal slip on the second-order pyramidal system. Available for 3D elements only.

BC1S 1,2,3,4,5,6 First set of six components of BCC slip on 111 plane. Available for 3D elements only.

BC2S 1,2,3,4,5,6 Second set of six components of BCC slip on 111 plane. Available for 3D elements only.

BC3S 1,2,3,4,5,6 First set of six components of BCC slip on 112 plane. Available for 3D elements only.

BC4S 1,2,3,4,5,6 Second set of six components of BCC slip on 112 plane. Available for 3D elements only.

BC5S 1,2,3,4,5,6 First set of six components of BCC slip on 123 plane. Available for 3D elements only.

BC6S 1,2,3,4,5,6 Second set of six components of BCC slip on 123 plane. Available for 3D elements only.

BC7S 1,2,3,4,5,6 Third set of six components of BCC slip on 123 plane. Available for 3D elements only.

BC8S 1,2,3,4,5,6 Fourth set of six components of BCC slip on 123 plane. Available for 3D elements only.

FC1H 1,2,3,4,5,6 First set of six components of FCC crystal hardness. Available for 3D elements only.

FC2H 1,2,3,4,5,6 Second set of six components of FCC crystal hardness. Available for 3D elements only.

HC1H 1,2,3,4,5,6 Sixcomponents of HCP crystal hardness on basal and prismatic systems. Available for 3D elements.

HC2H 1,2,3,4,5,6 Six components of HCP crystal hardness on pyramidal system. Available for 3D elements only.

HC3H 1,2,3,4,5,6 First set of six components of HCP crystal hardness on the first-order pyramidal system. Available for 3D elements only.

HC4H 1,2,3,4,5,6 Second set of six components of HCP crystal hardness on the first-order pyramidal system. Available for 3D elements only.

HC5H 1,2,3,4,5,6 Six components of HCP crystal hardness on the second-order pyramidal system. Available for 3D elements only.

BC1H 1,2,3,4,5,6 First set of six components of BCC hardness on 111 plane. Available for 3D elements only.

BC2H 1,2,3,4,5,6 Second set of six components of BCC hardness on 111 plane. Available for 3D elements only.

BC3H 1,2,3,4,5,6 First set of six components of BCC hardness on 112 plane. Available for 3D elements only.

BC4H 1,2,3,4,5,6 Second set of six components of BCC hardness on 112 plane. Available for 3D elements only.

BC5H 1,2,3,4,5,6 First set of six components of BCC hardness on 123 plane. Available for 3D elements only.

BC6H 1,2,3,4,5,6 Second set of six components of BCC hardness on 123 plane. Available for 3D elements only.

BC7H 1,2,3,4,5,6 Third set of six components of BCC hardness on 123 plane. Available for 3D elements only.

BC8H 1,2,3,4,5,6 Fourth set of six components of BCC hardness on 123 plane. Available for 3D elements only.

XELG 1,2,3,45,6,EQV Crystal Lagrangian strain in 11, 22, 33, 12, 23,13 directions and its equivalent. Available for 3D elements only.

SINT RHO, ETA, SSTR, GRAIN Sintering relative density, viscosity, sintering stress, and average grain size values.

^[a]For SHELL131 and SHELL132 elements with KEYOPT(3) = 0 or 1, use labels TBOT, TE2, TE3, . . ., TTOP instead of TEMP.

^[b]Element table option (Option) is available for this element output data item.

^[c]The results for this postprocessing SEND component are invalid for ELBOW290 when that element is used with viscoelastic or viscohyperelastic materials.

^[d]For MPC-based contact definitions, the value of STAT can be negative. This indicates that one or more contact constraints were intentionally removed to prevent overconstraint. STAT = -3 is used for MPC bonded contact; STAT = -2 is used for MPC no-separation contact.

^[e]Some element- and material-type limitations apply. For more information, see PRERR.

^[f]When using the EMFT procedure to calculate electromagnetic force (PLANE121, SOLID122, SOLID123, PLANE233, SOLID236 or SOLID237 elements only), the FMAG sum will be zero or near zero.

^[g]Failure criteria are based on the effective stresses in the damaged material.

^[h]Comp = SUM is not supported for coupled pore-pressure-thermal (CPTnnn) elements.

^[i]WEXT is calculated for element-based loading only (and not for nodal-force loading). WEXT is stored on elements to which loading has been applied; if surface elements are added on top of other elements, for example, and pressure loading is applied to the surface elements, WEXT is available for the surface elements only.

Table 114: ETABLE - Selected Result (SRES) Component Labels

ETABLE,`Lab`,SRES,`Comp`
Comp	Description
SVAR`n`	The `n`th state variable.
FLDUF0`n`	The `n`th user-defined field variable.
`ItemComp` (concatenated `Item` + `Comp` label) from Table 210: OSRESULT - Item and Component Labels^[a]	See the table for the combined item and component description.

^[a]See Example 10: Specifying and Retrieving Selected Result Output.

Menu Paths

Main Menu>General Postproc>Element Table>Define Table

Main Menu>General Postproc>Element Table>Erase Table