The direct method for performing a coupled-field analysis involves a single analysis using a coupled-field element. Table 2.1: Coupled-Field Elements lists the elements that have coupled-field capability.
Table 2.1: Coupled-Field Elements
Element Name | Description |
---|---|
SOLID5 (Legacy) | Coupled-field hexahedral |
PLANE13 (Legacy) | Coupled-field quadrilateral |
FLUID29 | Acoustic quadrilateral |
FLUID30 | Acoustic hexahedral |
LINK68 | Thermal-electric line |
CIRCU94 | Piezoelectric circuit |
SOLID98 (Legacy) | Coupled-field tetrahedral |
FLUID116 | Thermal-flow pipe |
CIRCU124 | General circuit |
TRANS126 | 1D electromechanical transducer |
SHELL157 | Thermal-electric shell |
CONTA172 | 2D surface-to-surface contact |
CONTA174 | 3D surface-to-surface contact |
CONTA175 | 2D/3D node-to-surface contact |
CONTA178 | 3D node-to-node contact |
CPT212 | 2D 4-node coupled pore-pressure-thermal mechanical solid |
CPT213 | 2D 8-node coupled pore-pressure-thermal mechanical solid |
CPT215 | 3D 8-node coupled pore-pressure-thermal mechanical solid |
CPT216 | 3D 20-node coupled pore-pressure-thermal mechanical solid |
CPT217 | 3D 10-node coupled pore-pressure-thermal mechanical solid |
PLANE222 | 2D 4-node coupled-field quadrilateral |
PLANE223 | 2D 8-node coupled-field quadrilateral |
SOLID225 | 3D 8-node coupled-field hexahedral |
SOLID226 | 3D 20-node coupled-field hexahedral |
SOLID227 | 3D 10-node coupled-field tetrahedral |
LINK228 | 3D coupled-field line |
Coupled-field elements contain all the necessary degrees of freedom. They handle the field coupling by calculating the appropriate element matrices (strong, or matrix coupling) or element load vectors (weak, or load vector coupling). In linear problems with strong coupling, coupled-field interaction is calculated in one iteration. Weak coupling requires at least two iterations to achieve a coupled response. Nonlinear problems are iterative for both strong and weak coupling. Table 2.2: Coupling Methods Used in Direct Coupled-Field Analyses lists the different types of coupled-field analyses available using the direct method, and which type of coupling is present in each. See Coupling Methods in the Theory Reference for more information about strong versus weak coupling.
Your finite element model may intermix certain coupled-field elements with the VOLT degree of freedom. To be compatible, the elements must have the same reaction solution for the VOLT degree of freedom. Elements that have an electric charge reaction solution must all have the same electric charge reaction sign. For more information, see Element Compatibility.
Table 2.2: Coupling Methods Used in Direct Coupled-Field Analyses
Type of Analysis | Coupling Method |
---|---|
Magneto-structural | Weak |
Electromagnetic | Strong |
Electromagnetic-thermal-structural | Weak |
Thermal-electromagnetic | Weak |
Piezoelectric | Strong |
Electrostatic-structural | Strong or weak |
Piezoresistive | Weak |
Thermal-pressure | Strong and weak |
Velocity-thermal-pressure | Strong |
Pressure-structural (acoustic) | Strong |
Thermal-electric | Weak (and strong, if Seebeck coefficients are defined) |
Thermal-magnetic | Weak |
Electromechanical | Strong |
Electromagnetic-circuit | Strong |
Electro-structural-circuit | Strong |
Structural-thermal | Strong or weak (and strong, if contact elements are used) |
Structural-thermal-electric | Strong and/or weak |
Structural-magnetic | Strong or weak |
Structural-electromagnetic | Strong or weak |
Structural-stranded coil | Strong or weak |
Thermal-piezoelectric | Strong |
Structural-diffusion | Strong or weak |
Thermal-diffusion | Strong or weak |
Structural-thermal-diffusion | Strong or weak |
Electric-diffusion | Strong or weak |
Thermal-electric-diffusion | Strong and/or weak |
Structural-electric-diffusion | Strong or weak |
Structural-thermal-electric-diffusion | Strong and/or weak |
Weak coupling effects are ignored in a substructure analysis, because an iterative solution is not available within the substructure generation pass.
Because of the possibly extreme nonlinear behavior of weakly coupled field elements, you may need to use the predictor and line-search options to achieve convergence. Nonlinear Structural Analysis in the Structural Analysis Guide describes these options.
To speed up convergence in a coupled-field transient analysis, you can disable the time integration effects for any degrees of freedom that are not a concern. For example, if structural inertial and damping effects can be ignored in a thermal-structural transient analysis, you can issue TIMINT,OFF,STRUC to turn off the time integration effects for the structural degrees of freedom.
Contact elements may also be included in a direct coupled-field analysis. For more information, see the following sections in the Contact Technology Guide:
Modeling Thermal Contact |
Modeling Electric Contact |
Modeling Magnetic Contact |
Modeling Pore Fluid Flow at the Contact Interface |
Modeling Diffusion Flow at the Contact Interface |
For information about coupled physics circuit simulations, see Coupled Physics Circuit Simulation.
The following additional direct coupled-field analysis topics are available:
- 2.1. Lumped Electric Elements
- 2.2. Thermal-Electric Analysis
- 2.3. Piezoelectric Analysis
- 2.4. Electrostatic-Structural Analysis
- 2.5. Piezoresistive Analysis
- 2.6. Structural-Thermal Analysis
- 2.7. Structural-Thermal-Electric Analyses
- 2.8. Magneto-Structural Analysis
- 2.9. Electromechanical Analysis
- 2.10. Thermal-Electromagnetic Analysis
- 2.11. Structural Implicit Gradient Regularization
- 2.12. Structural-Pore-Fluid-Diffusion-Thermal Analysis
- 2.13. Structural-Diffusion Analysis
- 2.14. Thermal-Diffusion Analysis
- 2.15. Structural-Thermal-Diffusion Analysis
- 2.16. Electric-Diffusion Analysis
- 2.17. Thermal-Electric-Diffusion Analysis
- 2.18. Structural-Electric-Diffusion Analysis
- 2.19. Structural-Thermal-Electric-Diffusion Analysis