This capability provides you with the ability to perform thermal and diffusion stress analyses. Applications include thermal expansion and hygroscopic swelling of polymers in electronics packages. You can also use this capability to perform hydrostatic stress migration and thermomigration analyses. Applications of hydrostatic stress migration include stress-assisted diffusion of hydrogen in metals.
The following related topics are available:
You can perform structural-thermal-diffusion analysis using PLANE222, PLANE223, SOLID225, SOLID226, or SOLID227. For detailed descriptions of the elements and their characteristics (degrees of freedom, KEYOPT options, inputs and outputs, etc.), see the Element Reference.
For coupled structural-thermal-diffusion analysis, you need to select the UX, UY, UZ, TEMP, and CONC element degrees of freedom by setting KEYOPT(1) to 100011 with PLANE222, PLANE223, SOLID225, SOLID226, or SOLID227.
Table 2.34: Elements Used in a Structural-Thermal-Diffusion Analyses
| Elements | Effects | Analysis Types |
|---|---|---|
|
PLANE222 - 4-Node Coupled-Field Quadrilateral PLANE223 - 8-Node Coupled-Field Quadrilateral SOLID225 - 8-Node Coupled-Field Hexahedral SOLID226 - 20-Node Coupled-Field Hexahedral SOLID227 - 10-Node Coupled-Field Tetrahedral |
Thermoelastic (Thermal Stress and Piezocaloric) Diffusion strain Hydrostatic stress migration[a] Temperature-dependent material properties, including temperature-dependent saturated concentration (CSAT) Thermomigration |
Static Full Transient |
To perform a structural-thermal-diffusion analysis, you need to follow the steps outlined in Performing a Structural-Thermal Analysis, Performing a Structural-Diffusion Analysis, and Performing a Thermal-Diffusion Analysis.