Solder Fatigue Analysis Using Sherlock and AEDT Icepak

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1. Introduction and Overview

1.1. Problem Definition
1.2. Flowchart of the Analysis

2. Sherlock: Exporting the PCB and Component Data

2.1. Importing the ODB++ File into the Sherlock Application
2.2. Update the Parts List
2.3. Export the EDB File
2.4. Import the EDB File into AEDT

3. Icepak: Setting Up the Thermal Simulation

3.1. Review the HFSS 3D Layout Design
3.2. Insert the Icepak Design
3.3. Create a PCB Component
3.4. Review the copper traces in Icepak
3.5. Resize the air region
3.6. Assign Boundary Conditions
3.7. Set the Ambient Temperature
3.8. Generate the Mesh
3.9. Create a Monitor Point
3.10. Enable Temperature Data Export to the Sherlock Application
3.11. Add Solution Setup and Analyze
3.12. Verify the Solution Convergence and Thermal Results
3.13. Verify the Exported .tmap File
3.14. Create a Copy of the Icepak Design
3.15. Update the Ambient Temperature and Analyze the Setup
3.16. Verify the Solution Convergence and Thermal Results
3.17. Verify the Exported .tmap File

4. Sherlock: Setting Up the Solder Fatigue Analysis—No Icepak Temperature Map

4.1. Define the Reliability Metric and Thermal Cycle
4.2. Run the Solder Fatigue Analysis
4.3. Review the Results

5. Sherlock: Setting Up the Solder Fatigue Analysis—Using the Icepak Temperature Map

5.1. Import the .tmap Files into the Sherlock Application
5.2. Review the Results with Icepak Imported Temperature
5.3. Comparison
5.4. Workshop Outcomes