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This tutorial demonstrates how to run an Ansys Sherlock™ Solder Fatigue analysis using a detailed temperature map generated by the Ansys Icepak® application. This approach can improve the accuracy of component life predictions in the following cases: When temperature dependent thermal properties are involved, when natural convection is a factor, or you must account for the temperature-dependent power dissipation of components.
In the tutorial, you will learn how to:
Set up a Solder Fatigue reliability analysis in the Sherlock application
Set up a Thermal Analysis in the AEDT (Ansys Electronics Desktop™) Icepak application
Export an AEDT Icepak temperature map file (.tmap)
Import the temperature map file into the Sherlock application
Solve the Sherlock Solder Fatigue analysis and review the results
Note: This tutorial was developed and tested in Sherlock 2024 R1. Although later releases are expected to behave in a similar way, this has not been tested and is not guaranteed. Also, some changes in the user interface may have occurred.