Contents Chapter 3: Icepak: Setting Up the Thermal Simulation | Print page 3.5. Resize the air regionResize the air region in the +Z and –Z directions. In this tutorial, a simple thermal model is used, but you can set up a system level model as needed without moving the PCB. « 3.4. Review the copper traces in Icepak 3.6. Assign Boundary Conditions »