The procedure for a coupled-field analysis depends on which fields are being coupled, but two distinct methods can be identified: load-transfer and direct. These methods are described briefly below, and in the following chapters in detail:
Load-Transfer Methods
Mechanical APDL also offers the following additional coupled-field method:
The direct method usually involves just one analysis that uses a coupled-field element type containing all necessary degrees of freedom. Coupling is handled by calculating element matrices or element load vectors that contain all necessary terms. An example of a direct method coupled-field analysis is a piezoelectric analysis using the PLANE222, PLANE223, SOLID225, SOLID226, or SOLID227 elements. Another example is MEMS analysis with the TRANS126 element. See Direct Coupled-Field Analysis for more details and examples.
The load-transfer methods involve two or more analyses, each belonging to a different field. You couple the two fields by applying results from one analysis as loads in another analysis. There are different types of load-transfer analyses, explained in the following sections.
You can couple different analyses manually as long as their underlying model geometry and mesh are the same. The general process is to set up the first analysis and solve. Then, specify different element types, additional material properties, and boundary conditions as appropriate for a subsequent analysis type. You can then link the two analyses by issuing LDREAD to read results from the first analysis as input loads in the subsequent analysis. See Load-Transfer Coupled Physics Analysis via the LDREAD command for detailed procedures. This method can be used unidirectionally or to pass results back and forth between different analyses types in an iterative solution with multiple LDREAD commands.
You can also couple a fluid-solid interaction analysis by unidirectional load-transfer. This method requires that you know that the fluid analysis results do not affect the solid loads significantly, or vice-versa. Loads from a Mechanical APDL analysis can be unidirectionally transferred to a CFX fluid analysis, or loads from a CFX fluid analysis can be transferred to an Mechanical APDL analysis. The load-transfer occurs external to the analyses. See Unidirectional Load-Transfer for CFD Applications for detailed procedures for both Ansys-to-CFX and CFX-to-Ansys unidirectional methods.
You can perform coupled-field analyses using a System Coupling component system in Workbench. Specifically, you can set up a one-way or two-way fluid-structure interaction (FSI) analysis or thermal-structural analysis by connecting a System Coupling component system to Mechanical, Fluent, and External Data systems.
Refer to System Coupling in the Mechanical User's Guide for more information on this load-transfer method. If you are new to Workbench, see the Overview in the Workbench User's Guide to get started. Workbench offers the combination of the core product solvers with project management tools that manage the project workflow.
This coupled-field analysis method supports the structural element types shown in Table 1.1: Structural Elements.
All thermal element types are supported; however, for SHELL131 and SHELL132 thermal shell elements, only the paint option (KEYOPT(6)=1, TEMP DOF on the bottom) is supported, and the temperatures or heat flows at the bottom are used in the coupling.
When coupling Mechanical and Fluent for a thermal-structural analysis, the coupled field elements SOLID226 and SOLID227 (KEYOPT(1)=11) need to be used in Mechanical. See Coupled Field Co-Simulation Using System Coupling in the Mechanical User's Guide for details about how to set up this type of analysis.
A system coupling analysis can be run from the command line, rather than by using the Workbench user interface. If the system coupling simulation involves Mechanical APDL, see Starting a Mechanical APDL Session from the Command Level in the Operations Guide for more information.
Direct coupling is advantageous when the coupled-field interaction involves strongly-coupled physics or is highly nonlinear and is best solved in a single solution using a coupled formulation. Examples of direct coupling include piezoelectric analysis, conjugate heat transfer with fluid flow, and circuit-electromagnetic analysis. Elements are specifically formulated to solve these coupled-field interactions directly.
For coupling situations which do not exhibit a high degree of nonlinear interaction, the load-transfer method is more efficient and flexible because you can perform the two analyses independently of each other. Coupling may be recursive, where iterations between the different physics are performed until the desired level of convergence is achieved. In a load-transfer thermal-stress analysis, for example, you can perform a nonlinear transient thermal analysis followed by a linear static stress analysis. You can then use nodal temperatures from any load step or time-point in the thermal analysis as loads for the stress analysis.
Direct coupling typically requires less user-intervention because the coupled-field elements handle the load-transfer. Some analyses must be done using direct coupling (such as piezoelectric analyses). The load-transfer method requires that you define more details and manually specify the loads to be transferred, but offers more flexibility in that you can transfer loads between dissimilar meshes and between different analyses.
The following table provides some general guidelines on using each method for different analyses and applications.
Table 1.2: Coupled Physics: Solution Methods and Applications within Mechanical APDL
| Coupled Physics | Direct | Load-Transfer | Physics Application |
|---|---|---|---|
| Thermal-structural | PLANE13, SOLID5, SOLID98, PLANE222, PLANE223, SOLID225, SOLID226, SOLID227. See Structural-Thermal Analysis. | You can also use LDREAD for the load-transfer method. | Varied, such as gas turbines, MEMS resonators |
| Thermal-electric | PLANE222, PLANE223, SOLID225, SOLID226, SOLID227 (Joule, Seebeck, Peltier, Thompson). See Thermal-Electric Analysis for a complete list of elements. | You can also use LDREAD for the load-transfer method. | Temperature sensors, thermal management, Peltier cooler, thermoelectric generators |
| Thermal-electric-structural | PLANE222, PLANE223, SOLID225, SOLID226, SOLID227. See Structural-Thermal-Electric Analyses for a complete list of elements. | You can also use LDREAD for the load-transfer method. Joule heating is supported by both the direct and load-transfer methods. Seebeck, Peltier, and Thompson effects are available only with the direct method. | Induction heating, RF heating, Peltier coolers |
| Piezoelectric | PLANE13, SOLID5, SOLID98, PLANE222, PLANE223, SOLID225, SOLID226, SOLID227. See Piezoelectric Analysis. | Microphones, sensors, actuators, transducers, resonators | |
| Electroelastic | PLANE222, PLANE223, SOLID225, SOLID226, SOLID227. See Electrostatic-Structural Analysis. | MEMS | |
| Piezoresistive | PLANE222, PLANE223, SOLID225, SOLID226, SOLID227. See Piezoresistive Analysis. | Pressure sensors, strain gauges, accelerometers | |
| Electromagnetic-thermal | PLANE13, SOLID5, SOLID98, PLANE223, SOLID226, SOLID227 | You can use LDREAD for the load-transfer method. | Induction heating, RF heating, Peltier coolers |
| Electromagnetic-thermal- structural | PLANE13, SOLID5, SOLID98 | You can use LDREAD for the load-transfer method. |
direct method: IC, PCB electro-thermal stress, MEMS actuators load-transfer method: Induction heating, RF heating, Peltier coolers |
| Acoustic-Structural (Inviscid FSI) | FLUID29, FLUID30 | Acoustics, sonar, SAW | |
| Circuit-coupled electromagnetic | CIRCU124 + CIRCU94. See Coupled Physics Circuit Simulation. | Motors, MEMS | |
| Electrostatic-structural | TRANS126 (see Electromechanical Analysis); PLANE222, PLANE223, SOLID225, SOLID226, SOLID227 | You can use LDREAD for the load-transfer method. | MEMS |
| Magnetic-structural | PLANE13, SOLID5, SOLID98, PLANE223, SOLID226, SOLID227. See Magneto-Structural Analysis. | You can use LDREAD for the load-transfer method. | Solenoids, electromagnetic machines |
| Fluid-thermal | CFX Conjugate heat transfer | Piping networks, manifolds | |
| Thermal-CFD | Electronics Cooling | ||
| FSI | --- | Unidirectional Mechanical APDL to CFX Load-Transfer (EXPROFILE) | Aerospace, automotive fuel, hydraulic systems, MEMS fluid damping, drug delivery pumps, heart valves |
| Magnetic-fluid | --- |
You can use LDREAD for the load-transfer method. LDREAD can read Lorentz forces into CFD mesh. | Fluid handling systems, EFI, hydraulic systems |
| Pore-fluid-diffusion-structural | CPT212,CPT213, CPT215, CPT216, CPT217. See Structural-Pore-Fluid-Diffusion-Thermal Analysis. | Use the sparse direct solver. | Tunnel excavating, nuclear waste disposal, oil drilling, bone deformation and healing |
In addition to the analysis methods discussed above, you can often perform coupled physics simulations using a circuit analogy. Components such as "lumped" resistors, sources, capacitors, and inductors can represent electrical devices. Equivalent inductances and resistances can represent magnetic devices, and springs, masses, and dampers can represent mechanical devices. Mechanical APDL offers a set of tools to perform coupled simulations through circuits. A Circuit Builder is available to conveniently create circuit elements for electrical, magnetic, piezoelectric, and mechanical devices. The Mechanical APDL circuit capability enables you to combine both lumped elements, where appropriate, with a "distributed" finite element model in regions where characterization requires a full finite element solution. A common degree-of-freedom set allows the combination of lumped and distributed models. See Coupled Physics Circuit Simulation for detailed procedures.