Chapter 59: Thermal-Structural Analysis of a Printed Circuit Board

This example problem shows how to use mesh-independent reinforcing elements to perform a thermal-structural analysis of a printed circuit board (PCB).

The following features and capabilities are highlighted:

Modeling using discrete and smeared reinforcing elements.
Thermal analysis followed by a downstream structural analysis.

The following topics are available:

59.1. Introduction
59.2. Problem Description
59.3. Modeling
59.4. Material Properties
59.5. Boundary Conditions and Loading
59.6. Analysis and Solution Controls
59.7. Results and Discussion
59.8. Recommendations
59.9. Input Files

For more information, see Reinforcing and Direct Element Embedding in the Structural Analysis Guide.

You can also perform this example analysis entirely in the Ansys Mechanical Application. For more information, see Thermal-Structural Analysis of a Printed Circuit Board in the Mechanical Technology Showcase: Example Problems.