This example problem shows how to use mesh-independent reinforcements to perform a thermal-structural analysis of a printed circuit board (PCB).
This example is simulated using the Ansys Mechanical Application. To see this example solved with Ansys Mechanical APDL see Thermal-Structural Analysis of a Printed Circuit Board in the Technology Showcase: Example Problems.
The following features and capabilities are highlighted:
Modeling using discrete and smeared reinforcing elements.
Thermal analysis followed by a downstream structural analysis.
Overview
| Analysis Type(s) | Steady-State Thermal and Static Structural analysis using Imported Body Temperature |
| Element Type(s) | 3-D Thermal Solid, 3-D Structural Solid, Line Reinforcement, and Shell Reinforcement |
| Solver Type(s) | Ansys Mechanical |