This example problem is a thermomechanical analysis of lead-free solder bumps subjected to cyclic thermal loading.
The following features and capabilities are highlighted:
Obtaining implicit creep material constants using experimental data.
Using creep and plasticity material models to simulate viscoplastic behavior.
Determining accumulated creep strain due to thermal loading.
The following topics are available:
You can also perform this example analysis entirely in the Ansys Mechanical Application. For more information, see Elastoplastic Creep Analysis of Lead-Free Solder Bumps in the Mechanical Technology Showcase: Example Problems.