35.9. References

The following reference works are cited in this example problem:

  1. Kornain, Z., Jalar, A., Amin, N., Rasid, R., & Foong, C. S. (2010). Comparative study of different underfill material on flip chip ceramic ball grid array based on accelerated thermal cycling. American Journal of Engineering and Applied Sciences. 3(1), 83-89.

  2. Shangguan, D. (2005). Lead-Free Solder Interconnect Reliability. Materials Park, OH: ASM International.

  3. Jong, W., Chien-Chia, C., Hsin-Chun, T., & Hsiu-Tao, C. (2005). Elastic-Plastic-Creep analysis of lead and lead-free solder bumps in FC. Annual Technical Conference (ANTEC) of the Society of Plastics Engineers. 1665-1669.

  4. Darveaux, R. & Reichman, C. (2007). Mechanical properties of lead-free solders. 57th Electronic Components and Technology Conference. 695-706.

  5. Clech, J. P. (January, 2015). Sn-Ag properties and creep data. Material Measurement Laboratory.

  6. Lau, J. H. & Pan, S. H. (2001). Creep behaviors of flip chip on board with 96.5Sn-3.5Ag and 100In lead-free solder joints. International Journal of Microcircuits and Electronic Packaging. 24, 11-18.