This example problem is a thermomechanical analysis of lead-free solder bumps subjected to cyclic thermal loading using the Ansys Mechanical Application. To see this example solved using Ansys Mechanical APDL see Elastoplastic Creep Analysis of Lead-Free Solder Bumps in the Technology Showcase: Example Problems.
The following features and capabilities are highlighted:
Using creep and plasticity material models to simulate viscoplastic behavior.
Determining accumulated creep strain due to thermal loading.
Overview
| Analysis Type(s) | Thermal Stress Analysis |
| Element Type(s) | 3-D SOLID |
| Solver Type(s) | Ansys Mechanical |