The following files were used in this problem:
Lead_Free_Solder.cdb -- Finite element model of the flip chip.
Thermal.dat -- Input file for the transient thermal analysis.
Structural.dat -- Input file for the structural analysis.
The following files were used in this problem:
Lead_Free_Solder.cdb -- Finite element model of the flip chip.
Thermal.dat -- Input file for the transient thermal analysis.
Structural.dat -- Input file for the structural analysis.