This example problem is a transient electromigration analysis of a solder ball. The finite element solution calculates the deviation in atomic concentration from an initial unit value due to the combined effect of diffusion, electromigration, stress migration, and thermomigration.

This example is simulated using the Ansys Mechanical Application. To see this example solved with Ansys Mechanical APDL see Electromigration in a Solder Ball in the Technology Showcase: Example Problems.

The following features and capabilities are highlighted:

Because some features demonstrated in this example are not implemented in the Mechanical user interface, Mechanical APDL command snippets are used in several steps of this analysis. For information on adding command snippets, see Commands (APDL).

Overview