This example problem is a transient electromigration analysis of a solder ball. The finite element solution calculates the deviation in atomic concentration from an initial unit value due to the combined effect of diffusion, electromigration, stress migration, and thermomigration.
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You can also perform this example analysis entirely in the Ansys Mechanical Application. For more information, see Electromigration in a Solder Ball in the Mechanical Technology Showcase: Example Problems.