A half symmetry model is used of a SnAgCu (SAC) solder joint sandwiched between two copper (Cu) plates is considered.
The distance between the conductors is 450 μm. The diameter of the solder ball is 760 μm, and its width where it meets the conductors is 612 μm. These dimensions approximately correspond to the ball grid array (BGA) structure.[1]
The conductors are 40 μm thick, 800 μm wide (400 μm in the half symmetry model), and 1000 μm long.
