The mesh is a higher order hexahedron-dominant mesh using SOLID279 elements for the Thermal Analysis and SOLID186 elements for the Structural Analysis.
Temperature profiles at different time steps, obtained from the transient thermal analysis, are used in the nonlinear structural analysis to predict residual creep strains in solder bumps. The analysis requires the same mesh used for thermal analysis.
Contact and target elements CONTA174 and TARGE170, respectively, are compatible with structural element SOLID186.
Surface-to-surface contact pairs are created between flip chip parts using CONTA174 and TARGE170 elements, as shown in the following figure.
