Welcome to HFSS 3D Layout Help
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HFSS 3D Layout helps you design multi-layer structures such as millimeter-wave integrated circuits (IC), micro-wave integrated circuits, printed circuit boards, planar antennas, and more by simulating their layout geometry. HFSS 3D Layout simulates layer structures of high-frequency electromagnetic fields through an innovated meshing technology called Phi mesher. The Phi mesher is an advanced, layout-based meshing tool that is capable of rapidly generating an initial mesh. This initial mesh facilitates faster simulations that can be further enhanced and accelerated using many of the various available adjuncts of high performance computing. You can take advantage of a closer integration between the 3D Layout and external data sources by using Layout Links, Cadence APD, and SPB.
HFSS 3D Layout is suitable for aiding in the design of the following multi-layer structures:
- Millimeter-wave integrated circuits
- Micro-wave integrated circuits
- Printed circuit boards
- Planar antennas
Before using HFSS 3D Layout, you can become familiar with it through getting started guides that are provided with the Ansys Electronics Desktop and its software systems such as Layout Editor, HFSS, and other tools for circuit and system simulation. This chapter describes the basics of using HFSS 3D Layout to design and simulate multi-layer structures for various materials, models, and excitations.
HFSS 3D Layout has three getting started guides to help you learn this product: