This example problem uses residual vectors to improve the solution accuracy in modal subspace based analysis methods, such as modal superposition and power spectral density (PSD) analyses. The problem includes a study of the computational efficiency of the results-expansion procedure used to obtain the full-model solution.
The example is simulated using the Ansys Mechanical application. To solve this problem with Ansys Mechanical APDL, see Dynamic Simulation of a Printed Circuit Board Assembly Using Modal Analysis Methods in the Technology Showcase: Example Problems.
Overview
| Analysis Type(s) | Modal Analysis and PSDAnalysis |
| Element Type(s) |
IC packages: 3-D 20-Node Structural Solid (SOLID186) Board: 4-Node Structural Shell (SHELL181) Vertical columns: 3-D 2-Node Beam (BEAM188) Contact Between IC packages and board: Contact surface: 3-D 8-Node Surface-to-Surface Contact (CONTA174) Target surface: 3-D Target Segment (TARGE170) |
| Solver Type(s) | Ansys Mechanical |
The following topics are available: