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1. Getting Started with Sherlock
1.1. Welcome to Sherlock
1.2. Start-Up and Configuration
1.2.1. Sherlock Licensing
1.2.2. Standard Folder Locations
1.2.3. For Linux Users
1.2.4. Optional Software Compatibility
1.2.5. Initial Testing and Configuration
1.2.6. Memory Management
1.2.7. 3D Viewer Compatibility
1.3. Compatibility with Earlier Versions of Sherlock
1.4. Sherlock Settings Dialog
2. Introductory Tutorials
2.1. Tutorial: Project Overview
2.1.1. Main Window
2.1.2. Importing a Project
2.1.3. Project Life Cycle
2.1.4. Circuit Card Information
2.1.5. Analysis
2.1.6. Results
2.1.7. Closing a Project
2.2. Tutorial: ODB++ Project Creation
2.2.1. Importing an ODB++ Archive
2.2.2. Project Name and Properties
2.3. Tutorial: Reviewing Part Properties
2.3.1. Managing Part Properties
2.3.2. Filtering and Selecting Parts
2.3.3. Changing Part Properties
2.3.4. Part Source Priority
2.3.5. Changing Properties for Multiple Parts
2.3.6. Confirming Parts
2.3.7. Updating Component Layers
2.4. Tutorial: Layer Viewer
2.4.1. Layer Viewer Overview
2.4.2. Launching the Layer Viewer
2.4.3. Reviewing Layers
2.4.4. Layer Panning and Zooming
2.4.5. Component Editor
2.4.6. Board Outline Editor
2.4.7. Other Layer Viewer Features
2.5. Tutorial: Ad Hoc Project Creation
2.5.1. Project Creation
2.5.2. Circuit Card Creation
2.5.3. Adding CAD Files
2.5.4. Importing a Bill of Materials
2.5.5. BGA Part Properties
2.5.6. Importing Pick & Place Data
2.5.7. Importing Copper Layers
2.5.8. Insulated Metal Substrate Stackup
2.5.9. Additional Stackup Tools
2.5.10. Reviewing the Board Outline
2.5.11. Reviewing Component Layers
2.5.12. Reviewing Drill Holes
3. User Reference
3.1. Sherlock Settings
3.1.1. Advanced Settings
3.1.2. Beta Features Settings
3.1.3. Color Settings
3.1.4. Data Store Settings
3.1.5. Debug Settings
3.1.6. FEA Analysis Settings
3.1.7. Launcher Settings
3.1.8. Meshing Settings
3.1.9. Part Library Settings
3.1.10. Report Settings
3.1.11. Score Settings
3.2. User Interface Overview
3.2.1. Main Window
3.2.2. Project Tree
3.2.3. Main Menu
3.3. Single and Multi-Project Mode
3.3.1. Multi-Project Mode
3.3.2. Single-Project Mode
3.3.3. Changing Project Directory
3.4. Circuit Card Assembly Files
3.4.1. Circuit Card Information
3.4.2. CCA File Properties Viewer
3.4.3. Creating a Circuit Card
3.4.4. Adding Files to a Circuit Card Assembly
3.4.5. Attaching Informational (Info) Files
3.4.6. CCA File Format Specifications
3.5. Layer Viewer
3.6. Importing Projects and ECAD Archives
3.6.1. How to Import a Project into Sherlock
3.6.2. Import-Compatible File Types
3.6.3. IPC-2581 Import Tutorial
3.7. Exporting Projects
3.7.1. Exporting Sherlock Projects (.zip, .dfr-result)
3.7.2. Exporting CCAs to Ansys Icepak / Electronics Desktop (.aedb)
3.7.3. Links to Other Types of Exports
3.8. Stackups and Copper Layers
3.8.1. Importing Copper Layers
3.8.2. Stackup Tools
3.9. Laminate Management
3.9.1. Laminate Manager
3.9.2. Laminate Manager Icon Ribbon
3.9.3. Filtering Laminates
3.9.4. Selecting Multiple Laminates for Editing, Exporting
3.9.5. Adding and Copying Laminates
3.9.6. Deleting Laminates
3.9.7. Exporting Laminates
3.9.8. Importing Laminates
3.9.9. Laminate Editor
3.9.10. Editing Multiple Laminates Simultaneously
3.10. Solder Management
3.10.1. Solder Manager Listing
3.10.2. Solder Editor
3.10.3. Temperature-Dependent Material Properties
3.10.4. Export Solders
3.10.5. Import Solders
3.11. Material Management
3.11.1. Material Manager Listing
3.11.2. Material Editor
3.11.3. Temperature-Dependent Material Properties
3.11.4. Export Materials
3.11.5. Import Materials
3.12. User Data Files and Documents
3.12.1. User Defined Data Files
3.12.2. User Document Files
3.12.3. User Properties File (user.properties)
4. Managing Parts in Sherlock
4.1. Parts List Overview
4.1.1. How Sherlock Generates the Parts List
4.1.2. The Importance of Reviewing Part Properties
4.1.3. The Parts List Interface
4.1.4. Customizing the Parts List
4.1.5. Filtering and Selecting Parts
4.1.6. Updating Component Layers
4.2. Parts List Management Tools
4.2.1. The Part Properties Viewer
4.2.2. The Part Editor
4.2.3. The Multi-Part Editor
4.2.4. The Package Chooser
4.2.5. Part Source Priority
4.2.6. Confirming Parts
4.2.7. Filtering the Parts List (Advanced)
4.2.8. Exporting the Parts List
4.2.9. Importing the Parts List
4.3. Building Custom Parts
4.4. Part Library
4.4.1. Parts Library Menu
4.4.2. Creating a Part Library
4.4.3. Part Library Management
4.4.4. Customized Search Results
4.4.5. Filtered Search Results
4.4.6. Update Part Library from Parts List
4.4.7. Update Parts List from Part Library
4.4.8. Import Part Data
4.4.9. Recover Part Library
4.5. Part Validation
4.5.1. Input Data
4.5.2. Analysis Options
4.5.3. Analysis Results
4.5.4. Component Analysis Part Validation
4.6. Approved Vendor List (AVL)
4.6.1. AVL Menu Options
4.6.2. Maintaining the AVL
4.6.3. Using The AVL
4.7. Part Wizard
4.7.1. Part Number Recognition
4.7.2. Viewing Part Wizard Patterns
4.7.3. Editing Part Wizard Patterns
4.7.4. Editing Part Wizard Default Properties
4.7.5. Editing Part Wizard Pattern Fields
4.7.6. Editing Part Wizard Field Codes
4.7.7. Managing Part Wizard Patterns
4.7.8. Bulk Pattern Testing
4.7.9. Bulk Test Results
4.7.10. Bulk Pattern Matching
4.8. Sherlock Part Properties
4.8.1. A - Part Properties
4.8.2. B - Properties
4.8.3. C - D Properties
4.8.4. E - J Properties
4.8.5. L - Properties
4.8.6. M - Properties
4.8.7. N - O Properties
4.8.8. P - Properties
4.8.9. Q - R Properties
4.8.10. S - Properties
4.8.11. T - Y Properties
4.9. Package Management
4.9.1. Package Manager Listing
4.9.2. Selecting a Package to Edit
4.9.3. Using the Package Editor
4.9.4. Adding and Copying Packages
4.9.5. Deleting Packages
4.9.6. Package Export and Import
4.9.7. Column Mappings
4.9.8. Package Previewer
4.10. Tables: Required Part Properties per Analysis Type
4.10.1. Required Part Properties for: Component Failure Analysis, DFMEA, and PTH Fatigue
4.10.2. Required Part Properties for: Semi-Conductor Wearout, Solder Fatigue, Thermal Derating, and Part Validation
4.10.3. Required Part Properties for Each FEA Analysis
5. Life Cycle Management
5.1. Tutorial Life Cycle
5.2. Phase Definitions
5.3. Project Life Cycles
5.3.1. Event Definitions
5.3.2. Thermal Event
5.3.3. Shock Event
5.3.4. Random Event
5.3.5. Harmonic Event
5.3.6. Load Direction and PCB Orientation
5.3.7. Life Cycle Editing
5.3.8. Life Cycle Import / Export
5.3.9. Life Cycle Manager
6. Failure Analysis
6.1. Design Failure Mode and Effects Analysis (DFMEA)
6.1.1. Managing DFMEA Data
6.1.2. Customizing DFMEA Data
6.1.3. Exporting DFMEA Data
6.1.4. Importing DFMEA Data
6.1.5. DFMEA Results
6.1.6. Net List
6.2. Component Failure Analysis
6.2.1. Input Data
6.2.2. Analysis Properties and Analysis Results
6.3. Plated Through Hole (PTH) Fatigue Analysis
6.3.1. Input Data
6.3.2. Analysis Properties
6.3.3. Analysis Results
6.4. Semiconductor Wearout
6.4.1. Input Data
6.4.2. Acceleration Factors
6.4.3. Documents
6.4.4. Analysis
6.5. Solder Fatigue Analysis
6.6. Solder Fatigue Analysis Module
6.6.1. Input Data
6.6.2. Solder Fatigue Properties Dialog
6.6.3. Pad Properties
6.6.4. Editing Solder Properties
6.6.5. Supported Solder Models
6.7. Using AEDT-Icepak Results in Sherlock for Solder Fatigue Analysis
6.7.1. Workflow Summary
6.7.2. TMAP File Specifications
6.8. Solder Fatigue Tool
6.9. Thermal Derating
6.9.1. Input Data
6.9.2. Analysis Options
6.9.3. Analysis Results
7. Finite Element Analysis (FEA) Overview
7.1. FEA Integration
7.2. FEA Engine
7.2.1. Selecting the FEA Engine
7.2.2. FEA Analysis Settings
7.3. Data Sources
7.3.1. Generated Data Source
7.3.2. Imported Data Source
7.3.3. Strain Map Import
7.4. FEA Models
7.4.1. Bonded Model
7.4.2. FEA Modeling Properties
7.4.3. Generate 3D Model
7.4.4. Export FEA Model
7.4.5. Run FEA Analysis
7.5. FEA Processing
7.6. FEA Results
7.6.1. Summary Panel
7.6.2. Tabular Results
7.6.3. Graphical Result Layers
7.6.4. 3D Results File
7.6.5. Log Files
8. FEA Modeling Guide
8.1. FEA- PCB Modeling
8.1.1. PCB Models
8.1.2. PCB Modeling Properties
8.1.3. PCB Material Management
8.1.4. PCB Model Tradeoffs
8.2. FEA- Mount Points and Fixtures
8.2.1. Mount Point & Fixture Types
8.2.2. Mount Point Management
8.2.3. Fixture Management
8.3. FEA- Cutouts and Drill Holes
8.3.1. Cutouts
8.3.2. Drill Holes
8.4. FEA- Trace Modeling
8.4.1. Tutorial Project
8.4.2. Accessing the Trace Modeling Context Menu
8.4.3. Trace Model Generation
8.4.4. Advanced Trace Modeling Settings
8.4.5. Trace Model Viewing
8.4.6. Trace Model Import
8.4.7. Trace Model and Sketch Export
8.4.8. Trace Reinforcement Export
8.4.9. Importing the STEP File into Ansys Workbench or Ansys Discovery
8.4.10. Trace Model Resolution
8.4.11. Trace Model Analysis
8.5. FEA- Image File Layers
8.5.1. Preparing Image Files
8.5.2. Adding Image File Layers
8.5.3. Image File Alignment
8.5.4. Converting a Copper Layer File to an Image File
8.5.5. Image Layer Stackup Data
8.5.6. Image Layer Trace Model
8.6. FEA- PCB Modeling Regions
8.6.1. Modeling Region Example
8.6.2. Modeling Region Editor
8.6.3. Using Modeling Regions
8.6.4. Common Examples
8.6.5. Hybrid Modeling
8.6.6. Hybrid Models with Sub-Assemblies
8.6.7. Creating a CCA from a Modeling Region
8.7. FEA- Part Modeling
8.7.1. Layer Viewer Component Selection
8.7.2. Component Size, Location, and Orientation
8.7.3. Editing Part Properties
8.7.4. 2D Component Outline
8.7.5. 3D Block Model
8.7.6. Corner Orientation
8.7.7. Corner Face Restrictions
8.7.8. 3D Part Model Viewer
8.7.9. FEA Model Properties
8.8. FEA- Lead Modeling
8.8.1. Lead Properties
8.8.2. Lead Modeling Analysis Properties
8.8.3. Advanced Lead Meshing
8.8.4. BGA Solder Ball Properties
8.8.5. Surface Mount Lead Modeling
8.8.6. Through-Hole Lead Modeling
8.8.7. Solder Ball Modeling
8.8.8. 2D Lead Viewing
8.9. FEA- Heat Sink Modeling
8.9.1. Heat Sink Modeling
8.9.2. Heat Sink Modeling Properties
8.9.3. Creating Heat Sinks
8.9.4. Updating Heat Sinks
8.9.5. Heat Sink Attachment Points
8.9.6. Viewing Heat Sink 3D Model
8.9.7. Heat Sink Analysis
8.10. FEA- Wire Bonds
8.10.1. Adding Wire Bonds
8.10.2. 3D Model Viewer
8.10.3. Editing Wire Bonds
8.10.4. Wire Bond Export
8.10.5. Wire Bond Import
8.10.6. 3D FEA Modeling
8.10.7. Wire Bond Results
8.11. FEA- Potting & Staking
8.11.1. Tutorial Project
8.11.2. 2D Modeling
8.11.3. PCB Shape
8.11.4. Rectangular Shape
8.11.5. Circular Shape
8.11.6. Slot Shape
8.11.7. Polygonal Shape
8.11.8. 3D Modeling
8.11.9. Potting and Part Elements
8.11.10. Potting and Lead Elements
8.11.11. Potting & Staking Examples
8.12. FEA- Mechanical Parts
8.12.1. Mechanical Part Viewing
8.12.2. Mechanical Part Editing
8.12.3. Mechanical Part Properties
8.12.4. Mechanical Part Multi-Edit
8.12.5. Mechanical Part Attachment Points
8.12.6. FEA Model
8.13. FEA- Sub-Assembly Analysis
8.13.1. Tutorial Review
8.13.2. Baseline Analysis
8.13.3. Adding an Assembly
8.13.4. Defining Assembly Points
8.13.5. Multiple Assemblies
8.13.6. Assembly Results
8.14. Advanced BGA Modeling
8.14.1. Creating the Detailed Component
8.14.2. Properties of Detailed BGA Component
8.14.3. Exporting the Detailed Component to Ansys Mechanical
9. FEA Analysis Types
9.1. FEA- Natural Frequency
9.1.1. Natural Frequency Input Data
9.1.2. Natural Frequency Analysis Properties
9.1.3. Natural Frequency Analysis Results
9.2. FEA- In-Circuit Testing (ICT)
9.2.1. ICT Input Data
9.2.2. ICT Analysis Properties
9.2.3. ICT Analysis Results
9.3. FEA- Mechanical Shock
9.3.1. Input Data
9.3.2. Mechanical Shock Analysis Properties
9.3.3. Mechanical Shock Analysis Results
9.4. FEA- Harmonic Vibration
9.4.1. Harmonic Vibe Input Data
9.4.2. Harmonic Vibration Analysis Properties
9.4.3. Harmonic Vibration Analysis Results
9.5. FEA- Random Vibration
9.5.1. Random Vibe Input Data
9.5.2. Random Vibration Analysis Properties
9.5.3. Random Vibration Analysis Results
9.6. FEA- Thermal Mech (Thermo-Mechanical)
9.6.1. Thermal Mech and Material Properties
9.6.2. Thermal Mech and Input Data
9.6.3. Overview of Thermal Mech Analyses
9.6.4. Thermal Mech Properties Dialog
9.6.5. Types of Thermal Mech Analyses
9.6.6. Summary of Analysis Combinations
9.6.7. Thermal Mech and Mount Points
9.6.8. Part Temp Rise and Thermal Map FAQ
9.6.9. Imported Data Source
9.6.10. Thermal Mech Analysis Results
9.7. FEA- Virtual Accelerometer
9.7.1. Accelerometer Editor
9.7.2. Accelerometer Results
9.8. FEA- Ansys Workbench™ Integration
9.8.1. Exporting a CCA from Sherlock to Workbench
9.8.2. Ansys Workbench Geometry and Materials Import
9.8.3. Performing the Analysis
9.8.4. Importing Analysis Results into Sherlock
9.9. FEA- Ansys Icepak Integration
9.9.1. Step 1: Exporting the .tcl File from Sherlock
9.9.2. Step 2: Creating the Icepak Project TZR File
9.9.3. Step 3: Modify or Add Additional Geometries
9.10. Strain Mapping in Sherlock
9.10.1. Strain Map Feature: Capabilities and Limitations
9.10.2. Adding Strain Map Files (Image or CSV) to Sherlock
9.10.3. Random Vibe Analysis Using Strain Maps
9.10.4. Harmonic Vibe Analysis Using Strain Maps
9.10.5. Mechanical Shock Analysis Using Strain Maps
9.10.6. Running a Strain Map Analysis on an Assembly
9.10.7. Results of the Strain Map Analysis
10. Viewing and Managing Analysis Results
10.1. Sherlock Results Viewer
10.1.1. The Results Viewer and Memory Management
10.1.2. Viewing Current Results
10.1.3. Saving Results
10.1.4. Renaming / Deleting Results
10.1.5. Viewing Saved Results
10.1.6. Exporting Saved Results
10.1.7. Console Window
10.2. Sherlock 2D Viewer
10.3. Sherlock 3D Viewer
10.3.1. Launching the 3D Viewer
10.3.2. Viewing and Configuring the 3D Results
10.3.3. 3D Viewer's Main Menu and Toolbar
10.3.4. Exporting 3D Images
10.3.5. The 3D Viewer and Memory Management
10.4. Reporting and Data Export
10.4.1. Generating Report Files
10.4.2. Exporting Graphical Data
10.4.3. Exporting Tabular Data
11. Integration with other Ansys Products
12. API Services