Finite Element Analysis (FEA) models 3D shapes by a collection of 3D elements (such as bricks or pyramids for example) that are connected by shared nodes or by surface/node constraints. Each element is assigned mechanical properties based on material content and external loads and/or constraints (for example, gravity, point forces, etc) are applied to the model to simulate the intended operational environment. FEA simulation techniques are then applied to predict the displacements and strains experienced by each node and element in the model.
Sherlock uses FEA simulations to perform the following types of analysis:
Natural Frequency (that is, modal response)
In-Circuit Testing (ICT) (that is, static load)
Mechanical Shock (that is, transient dynamic)
Harmonic Vibration (that is, modal dynamic)
Random Vibration (that is, modal dynamic)
Thermal Mech (that is, thermal cycling)
This document describes the overall FEA processing approach used by Sherlock to predict circuit card and component reliability. All the capabilities described in this document apply to each of the analysis types listed above, which are discussed in detail in subsequent sections.
Warning: Exercise caution when using multiple versions of Sherlock on the same project. To avoid inaccurate results, see the section Compatibility with Earlier Versions of Sherlock.
In this section, the following topics are covered: