| *Density, f(T,F,C,U) | | Isotropic Secant Coefficient of Thermal Expansion, f(T, F,
C, U) | | Orthotropic Secant Coefficient of Thermal Expansion, f(T, F,
C, U) | | Isotropic Instantaneous Coefficient of Thermal Expansion, f(T) | | Orthotropic Instantaneous Coefficient of Thermal Expansion, f(T) | |
Damping Factor
(α) | |
Damping Factor (β) | | Material
Dependent Damping | |
Coefficient of Thermal Expansion | | *Isotropic Elasticity, f(T,F,U) | | Orthotropic Elasticity, f(T,F,U) |
See Linear Material Properties in the Material Reference for a description
of the above properties.
|
Orthotropic Stress Limits, f(T,F,U) | |
Orthotropic Strain Limits, f(T,F,U) | |
Tsai-Wu Constants, f(T) | |
Puck Constants, f(T,F,U) | |
LaRc03/04 Constants, f(T) |
The above shape memory alloy material model properties
are supported for pre-stress modal based analysis but not for pure
modal based analysis.
Gasket Material Model is supported for pre-stress modal based
analysis but not for pure modal based analysis.
Hyperelastic Material Models are
supported for pre-stress modal based analysis but not for pure modal
based analysis.
|
