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1. Introduction to the Sherlock Part Build Guide
1.1. How to Use this Guide
1.2. Help in Understanding Sherlock's Part Properties
1.3. Important Tips Before You Get Started
1.4. Part Property Viewing/Editing Options
1.5. Common Materials Quick Reference
1.6. Updating Your Sherlock Part Library
2. How to Build a Chip Component (CC)
2.1. CC Package Properties
2.2. CC Lead Properties
2.3. CC Pad Properties
2.4. CC Solder Properties
2.5. Resistor Networks and Capacitor Arrays
3. How to Build a QFN/DFN
3.1. QFN/DFN Package Properties
3.2. QFN/DFN Lead Properties
3.3. QFN/DFN Pad Properties
3.4. QFN/DFN Solder Properties
3.5. QFN/DFN Die Properties
3.6. QFN/DFN Flag Properties
4. How to Build a SON Part
4.1. SON Package Properties
4.2. SON Lead Properties
4.3. SON Solder Properties
4.4. SON Die Properties
5. How to Build a BGA Part
5.1. BGA Package Properties
5.2. BGA Ball Properties
5.3. BGA Solder Properties
5.4. BGA Die Properties
6. How to Build an SMT Leaded Package
6.1. SMT Leaded Package Properties
6.2. SMT Leaded- Lead Geometry
6.2.1. Gullwing Lead Geometry
6.2.2. C-Lead/J-Lead Geometry
6.2.3. L-Lead Lead Geometry
6.2.4. Stub Lead Geometry
6.3. SMT Lead- Solder Properties
6.4. SMT Leaded- Die Properties
7. Die Properties Guide
7.1. Die Dimensions - Best Practices for Making Assumptions
7.2. Hierarchy of Die Assumption Practices
7.3. Chip Scale Devices (CSP)
7.4. Assuming Die Geometry using Flag Geometry
7.5. Assuming Die Geometry using Package Outline
7.6. Assuming Die Geometry Thickness Values
8. How to Build an Electrolytic Capacitor
8.1. Electrolytic Capacitor- SMT (VCHIP) Style
8.2. Electrolytic Capacitor- Thruhole Style
9. How to Build a Ceramic Oscillator
9.1. Ceramic Oscillator Package Properties
9.2. Ceramic Oscillator Lead Properties
9.3. Ceramic Oscillator Pad Properties
9.4. Ceramic Oscillator Solder Properties
10. How to Build an SMT Inductor
10.1. Inductor Package Material Properties
10.2. Inductor Styles
10.2.1. Leadless Molded Inductor
10.2.2. Leaded Molded Inductor
10.2.3. Coil Power Inductor
10.2.4. Wirewound Chip Inductor
11. How to Build Varistor and Thermistor Components
11.1. CC Varistor/Thermistor
11.2. Disc Varistor/Thermistor
11.2.1. Disc Varistor/Thermistor Package Properties
11.2.2. Disc Varistor/Thermistor Lead Properties
12. How to Build a Connector
12.1. Connector Package Properties
12.2. Connector Lead Properties
12.3. Connector Solder Properties
12.3.1. Solder Properties
12.3.2. Connector Die Properties
13. Checking Your Work
13.1. Use the 3D Viewer to Check Work
13.2. Use the Solder Fatigue Analysis to Check Work
13.3. Use the Part List Filter to Check Work