13.225. SOLID225 - 3D 8-Node Coupled-Field Solid

Matrix or VectorGeometryShape FunctionsIntegration Points
Stiffness and Stress Stiffness Matrices; and Thermal Expansion, Diffusion Expansion, and Electrostatic Force Load VectorEquation 11–217, Equation 11–218, and Equation 11–2192 x 2 x 2

1 if element shape is tetrahedral

Mass MatrixSame as stiffness matrix.2 x 2 x 2
Pressure Load VectorQuadEquation 11–70 and Equation 11–712 x 2
TriangleEquation 11–50 and Equation 11–513
Thermal Conductivity Matrix and Heat Generation Load VectorEquation 11–2272 x 2 x 2
Specific Heat MatrixEquation 11–227.2 x 2 x 2
Convection Surface Matrix and Load VectorEquation 11–227 specialized to the face2 x 2
Dielectric Permittivity and Electrical Conductivity Matrices; Charge Density, Joule Heating, and Peltier Heat Flux Load VectorsEquation 11–2282 x 2 x 2
Surface Charge Density Load VectorEquation 11–228 specialized to the face2 x 2
Diffusivity Matrix and Diffusing Substance Generation Load VectorEquation 11–2302 x 2 x 2
Diffusion Damping MatrixEquation 11–230. If KEYOPT(10) = 1, matrix is diagonalized as described in Lumped Matrices.2 x 2 x 2
Diffusion Flux Load VectorEquation 11–230 specialized to the face2 x 2
Thermoelastic stiffness and Damping MatricesSame as combination of stiffness and thermal conductivity matrices
Piezoelectric Coupling MatrixSame as combination of stiffness matrix and dielectric matrix
Seebeck Coefficient Coupling MatrixSame as combination of electrical conductivity and thermal conductivity matrices
Diffusion-elastic stiffness and damping matricesSame as combination of stiffness and diffusivity matrices

13.225.1. Other Applicable Sections

Structures describes the derivation of structural element matrices and load vectors as well as stress evaluations. General Element Formulations gives the general element formulations used by this element. Electromagnetics describes the derivation of electric element matrices and load vectors as well as electric field evaluations. Piezoelectrics discusses the piezoelectric capability used by the element. Piezoresistivity discusses the piezoresistive effect. Thermoelectrics discusses the thermoelectric effects. Thermoelasticity discusses the thermoelastic effects. Electroelasticity discusses the Maxwell stress electroelastic coupling. Thermoplasticity discusses the thermoplastic effect. Diffusion describes the derivation of diffusion matrices and load vectors. Structural-Diffusion Coupling discusses diffusion strain coupling.

13.225.2. Theory

This element uses the method (selective reduced integration technique for volumetric terms) (Hughes([221]), Nagtegaal et al. ([222]))

If KEYOPT(6) = 2 or 3, the enhanced strain formulation from the works of Simo and Rifai([318]), Simo and Armero([319]), Simo et al.([320]), Andelfinger and Ramm([321]), and Nagtegaal and Fox([322]) is used. It introduces additional internal (user-inaccessible) structural degrees of freedom (DOFs) to prevent shear and volumetric locking (KEYOPT(6) = 2) or shear locking only (KEYOPT(6) = 3). These internal DOFs are created and condensed out at the element level.