20.4. Material Properties

Material properties for the supporting columns, board, and IC packages are as follows:

Supporting Column Material Properties
Young's Modulus (ton/s2mm)71.0e3
Poisson's Ratio0.33
Density (ton/mm3)2.77e-009
Board and IC Packages Material Properties
Young's Modulus (ton/s2mm)1.1e3
Poisson's Ratio0.42
Density (ton/mm3)9.5e-010