Component Information

This information will generally describe the component. The Component Name is used in the schematic or in the SML file name to identify the component for later use.

Note:

When naming the component, spaces are not valid characters. Using a space in the component name will result in an error. The valid characters for the component name are a-z, A-Z, 0-9, and _.

  1. Enter the information in the fields to identify the component.
  2. The selection of the material is used to account for major behavioral differences between devices made from different materials. Currently Si and SiC for wide bandgap devices are supported. The compensation for the different values Vgap is done internally through appropriate adjustments of the correction coefficients.

  3. During the definition of a new device, the channel type (N-type or P-type) can be selected. For P-channel devices all values for any characteristic on following pages still must be entered as positive values. The fitting process will account for the actual sign of the value.

  4. The selection of the thermal model is available for Power MOSFET models. Some MOSFETs use a common die for the FET and the freewheeling diode. This selection is used to specify the type of the die. If the device has a single die for the FET and the FWD, the page for the thermal model of the FWD is not used. All parameters for the thermal behavior of the device are taken from the page for the thermal parameters of the FET.
  5. To define the Switching Energy and Delay Time Measurement criteria for a Basic Dynamic or Advanced Dynamic IGBT or a Basic Dynamic Power MOSFET, click next to the Manufacturer field to open the Manufacturer Data dialog box in which you can set the start and stop times for Eon, t(on), Eoff, and t(off) for the named manufacturer.
    Note:

    These criteria are not enabled for Average IGBT and Average Power MOSFET device characterization.

Use the Manufacturer Data dialog box to select the start and stop criteria for the switching times and energies from predefined lists. Because each manufacturer uses different criteria for these parameters, it is important to select the criteria which match the manufacturer of the device being characterized to help ensure that the configured device converges to the desired characteristics. Some choices are not yet available in the characterization tool. In such cases an approximation must be made. In most cases, the off-time starts when VGE starts to drop to when IC has dropped sufficiently; the on-time starts when VGE starts to increase to when IC has sufficiently increased. Click to display a dialog box with image buttons that depict each of the possible selections. Select the image that best matches the criteria and the combo box will be updated.

Note:

Some data sheets provide separate information for td(on/off), tr, and tf. The characterization process is not capable of fitting for td(on/off), tr, or tf separately. Therefore, it is fitting for the complete On-switch or Off-switch times, which consist of td(on) + tr = t(on) for the On-switch time and td(off) + tf = t(off) for the Off-switch time.

Note:

The following procedures suggest approximations for several manufacturers. If you have questions about these approximations, contact Ansys support.



  1. Click Next to continue characterizing the device (See Nominal Working Point Values).