This mapping option is an extension of the Theseus to Shell workflow with an explicit focus on the *MAT_TAUGHENED_ADHESIVE_POLYMER material model (also known as *MAT_252 or *MAT_TAPO). For brevity, Envyo documentation uses the name *MAT_252.
Here, the concepts and motivation are consistent with the Workflow with MAT_TAUGHENED_ADHESIVE_POLYMER Material Model for the SOLID-SOLID option. The key difference in the THESEUS-SOLID option is that the degree of cure (DoC) is not provided along the history variables as it is in the case of SOLID-SOLID. Instead, it is computed internally in the Envyo application based on the provided temperature history.
This section covers:
The idea behind this workflow is exactly the same as in Output: Initial Stress Cards for SOLID-SOLID and the corresponding Envyo application commands are identical to those given in Output: Initial Stress Cards for SOLID-SOLID. The only difference in the THESEUS-SOLID workflow is that the following steps are conducted internally:
Compute the nodal DoC-values based on the nodal temperature history. This step is exactly the same as in Theseus to Shell.
Compute the DoC-values for the integration points in each element by interpolating the nodal DoC-values. You must set the number of integration points per element in the input file.
For every integration point, the four functions in Output: Initial Stress Cards are evaluated, where p denotes the degree of cure. Furthermore, pgel refers to a gel point above which solidification of the material begins. You set pgel and the remaining 5 parameters (ξ1, χ1, β1, δ1 and δ2) to achieve the required characteristic curves.
For every element, write out ∗INITIAL_STRESS_SOLID cards containing the new history variables (ξ(p), χ(p), β(p), and δ(p)) at the integration points.
The idea behind this workflow is exactly the same as in Output: Initial Stress Cards and the corresponding Envyo commands are identical to those given in Output: New *PART and *MAT252 Cards for SOLID-SOLID. The only difference in the THESEUS-SOLID workflow is that the following steps are conducted internally:
Compute the nodal DoC-values based on the nodal temperature history. This step is exactly the same as in Theseus to Shell.
Compute average DoC for each element.
Sort the elements into buckets based on their average DoC values, defined by their lower and upper DoC values. You define the number of buckets and the ranges they cover.
For every bucket, create a new *PART card and corresponding *MAT_252 card. The material properties for the given part are modified based on the average DoC associated with bucket limits. All elements that fall into a given bucket are added to that part.
The *MAT_252 material model represents an adhesive material, and as such, it is typically augmented by the *MAT_ADD_COHESIVE keyword. Creating new parts and material cards for many buckets can make manually adding *MAT_ADD_COHESIVE cards a tedious task. Therefore, these cards are also generated by the Envyo application based on user inputs.
The above described workflows apply when modifying data on a source mesh instead of mapping the results from a source to a target mesh. No actual mapping occurs. When transferring data metween meshes, the discussed workflows (Output: Initial Stress Cards and Output: New *PART and *MAT252 Cards) are modified as follows: Upon completion of step 1, the nodal DoC-data is mapped from the source mesh to the target mesh. Subsequently, the procedure continues from step 2 for the target mesh. Of course, in this case, the Envyo application's input file must contain the appropriate commands regarding the mapping.
Since the THESEUS-SOLID workflow is based on the THESEUS-SHELL option, all commands from Theseus to Shell apply with the following differences:
For the current workflow the main option given below should be used:
ENVYO = THESEUS-SOLID
Since the THESEUS-SOLID option works only with solids, commands for other element types are not permitted.
Since the THESEUS-SOLID workflow is designed to work with the *MAT252 keyword, the commands defined in SOLID-SOLID must be used for the mapping output. Note that the current workflow calculates the DoC values based on the temperature history rather than reading it from the initial stress cards. Therefore, when using the THESEUS-SOLID option, the command DegreeOfCureHistoryPosition defined in SOLID-SOLID is not required.