Chapter 39: Wire Bonding Ultrasonic Transducer

This example problem couples structural, piezoelectric elements to analyze electrical excitation of an ultrasonic transducer used for wire bonding applications. The model includes piezoelectric material definition, and prestressed coupled field modal and harmonic response analyses. This problem is simulated here using the Ansys Mechanical Application. To see this example solved using Ansys Mechanical APDL see Wire Bonding Ultrasonic Transducer in the Technology Showcase: Example Problems.

Overview

Analysis Type(s)Coupled Field Modal/Harmonic
Element Type(s) 3-D SOLID, (SOLID226, SOLID186, SOLID187)
Solver Type(s) Ansys Mechanical