HFSS Setup: Advanced Tab
Click the Advanced tab of the HFSS Setup window to access the following settings.
Defeaturing
- Form polygon unions before meshing: specifies whether all objects are combined or “unioned” before meshing takes place. This can simplify the mesh; it can, however, also remove internal boundaries that may be desirable. “Unioning” is a complex operation and sensitive to almost coincident edges; in some instances, a union may produce undesirable results. Inspecting the mesh is a simple way to verify the operation.
- Remove voids with an area smaller than <value>: simplifies meshing by removing small voids.
- Remove Floating/Inactive Signal Net Geometry: removes floating and inactive signal net geometry.
Model Type: offers two types of models.
- General: offers standard mesh processing.
- Use polygon defeaturing: removes very close
points, points that do not contribute to the geometry of an edge (e.g., collinear), and very thin intrusions. When used with “unioning”, it can
be helpful in healing geometry that is not snapped together.
- Tolerance as a ratio of the data exent: tolerance value specified as a ratio of the overall data extent. This value must be very small.
- Absolute distance: tolerance specified as an absolute value (e.g., 0.0001mm).
- Point -to-edge and point-to-point snapping: snaps points to edges and points to points if they are within a minimum dimensional tolerance. This tolerance is based on geometry extents.
Note:From the Vias area, vias may be modeled as a simple 'wirebond' or as a 3D ribbon or solid. The values specified in the analysis setup only apply to vias that do not have specific property overrides; all properties explicitly specified for a via take precedence over these values.
- Use polygon defeaturing: removes very close
points, points that do not contribute to the geometry of an edge (e.g., collinear), and very thin intrusions. When used with “unioning”, it can
be helpful in healing geometry that is not snapped together.
- IC [Beta]: optimizes mesh processing to simulate on-chip structures.
- Auto: automatically sets the model resolution.
- Length: allows you to manually set the model resolution.
Vias
- Mesh as a 3D via: vias are modeled using rectangles to form a 3D ribbon or solid.
- Number of sides: number of sides to use when creating the 3D representation. If less than 3, the via is modeled as a flat ribbon.
- Via material default: when a material has not been specified in the padstack definition and there is no override in the properties for a via, then this is the material associated with the via mesh. It is initially set to copper.