Chapter 11: Integration with other Ansys Products

The following sections in the user's guide provide guidance in integrating other Ansys products into your Sherlock workflow:

FEA Analysis:

  • Ansys Workbench™ / Ansys Mechanical™ applications: The Ansys Workbench application is a simulation integration platform, a widely used FEA tool combining the ease of a point-and-click interface with the power of Ansys analysis engines.

    • From the Sherlock application, you can export circuit card data directly into a Workbench analysis stream and then import reliability results back to the Sherlock application as part of a Workbench solution. In the FEA Analysis Types section, see FEA- Ansys Workbench™ Integration.

    • Starting with release 2024 R2, Sherlock automates the process of modeling a BGA component in greater detail for export to Ansys Mechanical. See Advanced BGA Modeling.

  • Ansys Icepak® electronics cooling simulation software (the classic version, not the version in Ansys Electronics Desktop™): Icepak is an industry leading software application which performs thermal and fluid flow analyses of integrated circuits, packages, printed circuit boards, and electronic assemblies—all powered by Ansys Fluent®'s Computational Fluid Dynamics (CFD) solver. When exporting to Icepak, Sherlock provides the package geometries and material properties with the level of detail needed for highly accurate thermal analysis. This workflow is described the in the FEA Analysis Types section. See FEA- Ansys Icepak Integration.

  • Ansys LS-DYNA® nonlinear dynamics structural simulation software: The LS-DYNA application is a general-purpose finite element program capable of simulating complex real world problems. It is used by the automobile, aerospace, construction, military, manufacturing, and bioengineering industries. When running an FEA Mechanical Shock Analysis in the Sherlock application, you can import LS-DYNA analysis results by selecting LS-DYNA as the Imported Data Source as explained here: LS-DYNA Imported Data Source.

Solder Fatigue

Ansys AEDT Icepak electronics systems design platform (Ansys Electronics Desktop version): Sherlock's Solder Fatigue Analysis Module allows you to input thermal analysis results generated in Ansys Electronics Desktop (AEDT) - Icepak. This workflow is described in Using AEDT-Icepak Results in Sherlock for Solder Fatigue Analysis.