The idea behind this workflow is exactly the same as in Output: Initial Stress Cards for SOLID-SOLID and the corresponding Envyo application commands are identical to those given in Output: Initial Stress Cards for SOLID-SOLID. The only difference in the THESEUS-SOLID workflow is that the following steps are conducted internally:
Compute the nodal DoC-values based on the nodal temperature history. This step is exactly the same as in Theseus to Shell.
Compute the DoC-values for the integration points in each element by interpolating the nodal DoC-values. You must set the number of integration points per element in the input file.
For every integration point, the four functions in Output: Initial Stress Cards are evaluated, where p denotes the degree of cure. Furthermore, pgel refers to a gel point above which solidification of the material begins. You set pgel and the remaining 5 parameters (ξ1, χ1, β1, δ1 and δ2) to achieve the required characteristic curves.
For every element, write out ∗INITIAL_STRESS_SOLID cards containing the new history variables (ξ(p), χ(p), β(p), and δ(p)) at the integration points.