The idea behind this workflow is exactly the same as in Output: Initial Stress Cards and the corresponding Envyo commands are identical to those given in Output: New *PART and *MAT252 Cards for SOLID-SOLID. The only difference in the THESEUS-SOLID workflow is that the following steps are conducted internally:
Compute the nodal DoC-values based on the nodal temperature history. This step is exactly the same as in Theseus to Shell.
Compute average DoC for each element.
Sort the elements into buckets based on their average DoC values, defined by their lower and upper DoC values. You define the number of buckets and the ranges they cover.
For every bucket, create a new *PART card and corresponding *MAT_252 card. The material properties for the given part are modified based on the average DoC associated with bucket limits. All elements that fall into a given bucket are added to that part.
The *MAT_252 material model represents an adhesive material, and as such, it is typically augmented by the *MAT_ADD_COHESIVE keyword. Creating new parts and material cards for many buckets can make manually adding *MAT_ADD_COHESIVE cards a tedious task. Therefore, these cards are also generated by the Envyo application based on user inputs.