The beta feature, when enabled, changes the BGA solder fatigue model to include the following improvements:
An updated solder fatigue model that splits the strain energy density in a given temperature range (
, 
) into hot (
, 
) and cold (
, 
) strain energies.Inclusion of interfacial stiffness between PCB and the copper pad based on foundation stiffness formulation.
Improved solder stress based on an area weighted solder shear modulus.
The beta feature affects BGA solder fatigue in two Sherlock modules:
The Solder Fatigue module under the Tools menu.
The solder model requires a Resin modulus for foundation stiffness calculation and has been added as an entry field in the Solder Fatigue Tool.
The Solder Fatigue analysis located under the Analysis item in the Sherlock Project Tree.
The beta feature currently uses 3500 MPa as default. This is a known issue with the beta feature. When the functionality is integrated into the application in a future release, the application will use the resin modulus from the stackup.
