Only one quarter of the structure of the chip resistor assembly is modeled due to the structural symmetry of the assembly:
Because this study focuses on solder-joint damage, the solder joint is meshed regularly using a fine meshing size using CPT216. Other parts were meshed with SOLID186 using the sweep method. To facilitate analysis speed, the PCB model consists of one layer.
Other components are meshed freely with much coarser meshing sizes to reduce the number of elements and nodes.
The model is composed of 13366 elements and 59666 nodes.