Ansys Granta MI Pro

Data is exported to a text file, and converted to consistent SI units.

If engineering stress-strain is used in a datasheet, it will be converted to true plastic stress-strain. (This requires a tensile modulus value at the temperature of each exported stress-strain curve.)

MaterialUniverse

• Base material
• Coercive force Hc
• Compositional summary
• Condition
• Core loss (by weight)
• Core loss alpha
• Core loss Cm
• Core loss Kc
• Core loss Ke
• Core loss Kh
• Core loss X
• Core loss Y
• Density
• Density with temperature
• Designation
• Dielectric constant (relative permittivity)
• Dielectric loss tangent (Df) with frequency
• Dissipation factor (dielectric loss tangent)
• Dynamic viscosity (absolute viscosity)
• Dynamic viscosity with temperature
• Electrical conductivity
• Electrical conductivity with temperature
• Electrical resistivity
• Electrical resistivity with temperature
• Elongation
• Fatigue S-N curve
• Glass temperature
• Intrinsic coercive force Hci
• Magnetic B-H curve
• Maximum permeability
• Maximum service temperature
• Molecular mass
• Poisson's ratio
• Relative permittivity (Dk) with frequency
• Remanent induction Br
• Saturation induction Bs
• Specific heat capacity
• Specific heat capacity with temperature
• Tangent modulus
• Tensile strength
• Tensile strength with temperature
• Thermal conductivity
• Thermal conductivity with temperature
• Thermal expansion coefficient
• Thermal expansion coefficient with temperature
• Thermal expansion coefficient with temperature_Reference Temp
• Tradenames
• True plastic stress-strain
• UNS number
• Yield strength (elastic limit)
• Yield strength with temperature
• Young's modulus
• Young's modulus with temperature

Global Polymers Plastics

• CLTE, Flow
• CLTE, Flow (TMA)
• CLTE, Transverse
• CLTE, Transverse (TMA)
• Coeff of Thermal Expansion vs. Temperature
• Density
• Density vs. Temperature
• Dielectric Constant (Cured)
• Dielectric Constant 1 to 999 GHz
• Dielectric Constant 1 to 999 Hz
• Dielectric Constant 1 to 999 kHz
• Dielectric Constant 1 to 999 MHz
• Dissipation Factor 1 to 999 GHz
• Dissipation Factor 1 to 999 Hz
• Dissipation Factor 1 to 999 kHz
• Dissipation Factor 1 to 999 MHz
• Elongation at Break MD (Films)
• Elongation at Break TD (Films)
• Flexural Modulus
• Generic Polymer Type
• Glass Transition Temperature
• Nominal Tensile Elongation at Break
• Poisson's Ratio
• Poisson's Ratio vs. Temperature
• Product Description
• Specific Heat Capacity
• Specific Heat Capacity vs. Temperature
• Tensile Elongation at Break
• Tensile Elongation at Break (Elastomers)
• Tensile Elongation at Break (Cured)
• Tensile Elongation at Break (Films)
• Tensile Fatigue
• Tensile Modulus
• Tensile Modulus (Cured)
• Tensile Modulus (Films)
• Tensile Modulus vs. Temperature
• Tensile Modulus vs. Temperature, Dynamic
• Tensile Strength
• Tensile Strength (Cured)
• Tensile Strength (Elastomers)
• Tensile Strength (Films)
• Tensile Strength at Break
• Tensile Strength at Yield
• Tensile Strength at Yield (Elastomers)
• Tensile Strength at Yield (Films)
• Tensile Strength at Yield MD (Films)
• Tensile Strength at Yield TD (Films)
• Tensile Strength at Yield vs. Temperature
• Thermal Conductivity
• Thermal Conductivity vs. Temperature
• True Stress vs. Plastic Strain
• Volume Resistivity
• Volume Resistivity (Cured)
• Volume Resistivity vs. Temperature

MMPDS

• Condition
• Density
• Electrical Conductivity
• Elongation with Temp.
• Elongation, L
• Fatigue Best Fit (S/N), L
• Modulus, L
• Poisson's Ratio, L
• Specific Heat
• Specific Heat with Temp.
• Tens. Ult. Stress (L-dir) with Temp.
• Tens. Yield Stress (L-dir) with Temp.
• Tensile Modulus (L-dir) with Temp.
• Tensile Stress/Strain, L
• Thermal Conductivity
• Thermal Conductivity with Temp.
• Thermal Expansion
• Thermal Expansion with Temp.
• Ultimate Tensile Strength, L
• Yield Strength, L