Specifying Chip Package Protocol Header Information in Q3D Extractor

Chip Package Protocol (CPP) is a set of statements specifying the location, the net information, and the SPICE node name for each package pin (the landing pad of flip-chip bumps or the chip landing pad of bonding-wires). It is embedded within a SPICE-compatible file header as comments.

The CPP is primarily used to help automate the co-simulation of IC (die) and package or package/board. For example, Apache's Redhawk utilizes CPP to import the package or package and PCB model into the full chip dynamic voltage drop analysis, and the global IO-SSO analysis. Package/PCB simulation tool can utilize the CPP to import the chip model in the system level analysis.

To specify the CPP information:

1. When exporting circuit data, select the Include Chip Package Protocol check box.

   

2. Click Edit.

   The Edit Chip Package Protocol window appears.

   

3. Set the following options:
   • Package Type – Choose from wirebond dieup, wirebond diedown, flipchip dieup, and flipchip diedown.
   • Coordinate System – Select either Global or a custom coordinate system.
   • Length Units – Select the unit of measure.
4. Use the options under Set Pins Attributes to select pins.
   • Select pins by – Use the drop-down menu to sort pins by component name, pin name (number), pin type (signal or power ground), net name, or port type (DIE, PCB, VRM, OTHER). Enter a regular expression into the search field and click Select to select the applicable pins.
   • Select All – Click to select all pins in the design.
5. Use the Component Name, Pin Type, and Port Type fields to modify the information for selected pin(s). Click Set to apply changes.
6. Click OK to exit the Edit Chip Package Protocol window.