Icepak Classic Project Conversion Limitations
The following features and settings are not supported and, therefore, not converted when opening an Icepak Classic .tzr file in the Electronics Desktop.
Naming
- The Electronics Desktop limits the number of characters for a given object name to 60 characters. Icepak Classic objects with names longer than 60 characters are truncated.
- The Electronics Desktop limits the number of characters for a given material name to 45 characters. Icepak Classic objects with names longer than 45 characters are truncated.
- Minor naming differences may occur (e.g., block.1 converted to block_1).
- Names that are considered unique in Icepak Classic (e.g., block.1 and Block.1) may be considered duplicate in the Electronics Desktop. To avoid incorrect assignment of boundary conditions, names are made unique by appending "_1" to the name (e.g., block_1 and Block_1_1).
- For all assemblies/mesh regions, _mr is appended to the assembly name.
- Point monitors will be prepended with pmon_, and face monitors are prepended with fmon_.
- All non-ascii characters and special characters are translated as an underscore character (_).
- When opening an Icepak Classic file in the Electronics Desktop on a Linux system, the file name and file path must not contain more than one space.
Project Settings
- Object groups
Mesh Settings
In Icepak Classic, an assembly's local Maximum element size can be overridden by global mesh settings. Ensure that Maximum element size for mesh regions in the Electronics Desktop are set appropriately before meshing.
- Hexa unstructured mesh type is converted to Mesher-HD
- Hexa cartesian mesh type is converted to Mesher-HD
- External assemblies
Mesh Operation
- Mesh operations are not supported for Packages and all unsupported Icepak Classic Objects.
- Mesh operations are not supported for assemblies.
- A mesh operation is not created for a fan guard.
Mesh Reuse Settings
- Assemblies
- Cabinet
- Fan
- Heatsink
- PCB
- Groups
- Sheet bodies are not supported. Only solid bodies are supported.
Object Priority Settings
The following are not assigned priority values:
- Assemblies
- Unsupported Icepak Classic Objects
- Inactive Objects
Solver Settings
- Surface to surface radiation is converted to Discrete ordinates radiation.
Note:
In the Electronics Desktop, Discrete ordinates is enabled even when Surface to surface radiation contains no objects selected under Participating objects in the Icepak Classic project.
- Autosave interval for steady-state simulations
High Performance Computing Settings
-
The number of cores and tasks must be specified in the Electronics Desktop after converting a Classic Icepak file.
Transient Settings
- Solution restart settings
- Joule heating properties for block and network boundary conditions
- Fields summary times (defaults to 0s)
Materials
- Biaxial materials
- Anisotropic materials
Geometry
- Geometry with applied texture
- A polyhedron whose base and top have differing numbers of sides is not supported (e.g., the base is a hexagon and top is a pentagon).
Icepak Classic Objects
- PCBs with MCAD substrates that contain ECAD traces inside are not supported.
- Packages
- ECAD-based packages: flip-chip and PBGA packages are supported; others are not supported.
- Non-ECAD-based packages: stacked die, package-on-package, and QFN are not supported.
- MCAD substrates with ECAD traces inside are not supported
- Heat exchangers
- Periodic boundaries
Blocks
- SIwave profile (solid blocks)
- LED source (blocks)
- MCAD blocks with ECAD
- Blocks with ECAD with Resize object with traces enabled
Networks
- For some cases, the schematic editor displays Page ports.
- Networks objects with CAD faces are not imported.
Walls
- Moving wall
Plates
- Temperature limit
Resistances
- Flow direction
- Species
PCBs
- Only ECAD based PBGA and Flip-chip package types are supported.
- ECAD PCB with MCAD-based substrate
- PCBs with ECAD with Resize object with traces enabled
- Multiple ECAD Layout Designs under the same original project in an Icepak Design
- SIwave profile
Packages
- Mesh operations
- Non-ECAD packages of type Stacked Die, Package on Package, QFP, and QFN
- ECAD package with MCAD-based substrate
- Non-ECAD packages are not imported as a 3D component.
Heatsinks
- Simple heatsinks
- Cylindrical fin heatsinks: Staggered pin alignment
- Cells between pins (a per-object mesh setting)
Fans
- Polygonal fan
- MCAD fan geometry is imported without thermal properties.
- Fan guard
- Gauge pressure
Grilles
- Velocity loss coefficient is set to automatic because device/approach options are unsupported.
- Flow direction
- Species
Sources
- Spatial profile for 3D sources
- Temperature limit
- LED
- Species
- Fixed temperature for 3D sources
- Transient joule heating properties for 3D sources
Openings
- Species
- Turbulence
- Spatial profile for openings with mass flow specified
Chip Thermal Models
- CTM powermaps are converted to individual sources.
Assemblies
- Assemblies with unsupported Icepak Classic Objects
- Per-object mesh settings for Packages
- An active object under an inactive assembly is not imported unless the TZR_Inactive_items environment variable is set.
- Assemblies superimposing the cabinet object are imported. The mesh region geometry must be edited to exist within the computational domain (Region) prior to meshing or running the simulation.
Monitors
- Surface monitors on a PCB, Fan, or Heatsink
- Point monitors assigned to a 3D CAD source object with a Thermal specification of Fixed Temperature are not imported.
Post-processing
- Show mesh for plane cuts, object faces, and point reports
- Summary report information on Block-based PCB objects
- For light-weight imported CAD geometries, only the full object can be selected when creating object faces and field summary entries.
- For light-weight imported CAD geometries in Field Summary entries, Inside, Interior, and Sides options are not supported.
ECAD
- For PCBs, Packages, and Blocks with ECAD, only non-zero thickness layers are imported.
- Projects with any ECAD cannot be imported into Ansys Electronics Desktop Student.