Many ODB++ directories do not contain information that is required by Electronics Desktop and SIwave, such as material and layer characteristics (e.g., height). This information is sometimes exported by the original source program (e.g., Cadence, Mentor Graphics) to the ODB++ directories and can then be used by the ODB++ Translator. But if this information is not present in the ODB++ directory, or if the information is present but needs to be changed, a separate input control file can be provided by the ODB++ Translator.
The Electronics Desktop input control file is in XML and can be created using standard third party text editors such as Notepad in Microsoft Windows or VI in Linux. The associated XML schema file, "stackup.xsd," is located in the parent Electronics Desktop installation directory. The schema file can be used with third-party editors or scripting tools that check XML syntax. Specific keywords that are valid to use in the control file can be found in the "stackup.xsd" schema. The associated XML schema for the import options information is "ImportOptions.xsd".
You are not required to use a control file when importing OBD++ files. However, if you do not use a control file, stackup and material definitions may not be defined. If you do use a control file, you can adjust the stackup either manually or by importing the control file into the design using the stackup window. If you import the control file, the stackup are modified according to rules described in Importing a Stackup.
Control files may be used for:
- ODB++ import
- Import using the stackup window
- AutoCAD import — AutoCAD import uses any specified stackup, material, or import option information specified in the control file to fill the import window and set up for import.
- GDSII import — GDSII import uses any specified stackup or material information specified in the control file to fill the import window and set up for import.
An example of a control file follows. The first three lines are heading lines that are required in all control files used with the ODB++ Translator. From the following example, after the heading lines, two other sections are present: one for materials and one for layers.
<?xml version="1.0" encoding="UTF-8" standalone="no" ?>
<c:Control xmlns:c="http://www.ansys.com/control" schemaVersion="1.0">
<Stackup schemaVersion="1.0">
<Materials>
<Material Name="FR4_epoxy">
<Permittivity>
<Double>4.4</Double>
</Permittivity>
<DielectricLossTangent>
<Double>0.02</Double>
</DielectricLossTangent>
<ThermalConductivity>
<Double>0.294</Double>
</ThermalConductivity>
<ThermalExpansionCoefficient>
<Double>1.5e-05</Double>
</ThermalExpansionCoefficient>
<MassDensity>
<Double>1900</Double>
</MassDensity>
<YoungsModulus>
<Double>11000000000</Double>
</YoungsModulus>
<PoissonsRatio>
<Double>0.28</Double>
</PoissonsRatio>
</Material>
<Material Name="copper">
<Permeability>
<Double>0.999991</Double>
</Permeability>
<Conductivity>
<Double>58000000</Double>
</Conductivity>
<ThermalConductivity>
<Double>400</Double>
</ThermalConductivity>
<ThermalExpansionCoefficient>
<Double>1.77e-05</Double>
</ThermalExpansionCoefficient>
<MassDensity>
<Double>8933</Double>
</MassDensity>
<YoungsModulus>
<Double>120000000000</Double>
</YoungsModulus>
<PoissonsRatio>
<Double>0.38</Double>
</PoissonsRatio>
</Material>
</Materials>
<ELayers LengthUnit="mm">
<Dielectrics>
<Layer Material="air" Name="Air Top Generated" Thickness="1.71453000000002e-05"/>
<Layer Color="#804000" Material="FR4_epoxy" Name="Dielectric_1" Thickness="0.1111253"/>
<Layer Color="#ffff00" Material="FR4_epoxy" Name="Dielectric_2" Thickness="0.1695453"/>
<Layer Color="#800000" Material="FR4_epoxy" Name="Dielectric_3" Thickness="0.1619253"/>
<Layer Color="#004080" Material="FR4_epoxy" Name="Dielectric_4" Thickness="0.1695453"/>
<Layer Color="#ff7a7a" Material="FR4_epoxy" Name="Dielectric_5" Thickness="0.1619253"/>
<Layer Color="#808000" Material="FR4_epoxy" Name="Dielectric_6" Thickness="0.2711453"/>
<Layer Color="#0000ff" Material="FR4_epoxy" Name="Dielectric_7" Thickness="0.2711453"/>
<Layer Color="#fa0000" Material="FR4_epoxy" Name="Dielectric_8" Thickness="0.2711453"/>
<Layer Color="#bdbd00" Material="FR4_epoxy" Name="Dielectric_9" Thickness="0.2711453"/>
<Layer Color="#ff0080" Material="FR4_epoxy" Name="Dielectric_10" Thickness="0.2711453"/>
<Layer Color="#00ff00" Material="FR4_epoxy" Name="Dielectric_11" Thickness="0.09334530000000001"/>
</Dielectrics>
<Layers>
<Layer Color="#00ff00" Elevation="2.2231383" Material="copper" Name="Top_L1" Thickness="0.0171453" Type="conductor"/>
<Layer Color="#8000ff" Elevation="2.112013" Material="copper" Name="GND_1_L2" Thickness="0.0171453" Type="conductor"/>
<Layer Color="#008080" Elevation="1.9424677" Material="copper" Name="Inner_Layer_1_L3" Thickness="0.0171453" Type="conductor"/>
<Layer Color="#ff8000" Elevation="1.7805424" Material="copper" Name="GND_2_L4" Thickness="0.0171453" Type="conductor"/>
<Layer Color="#00ff80" Elevation="1.6109971" Material="copper" Name="Inner_Layer_2_L5" Thickness="0.0171453" Type="conductor"/>
<Layer Color="#3dffff" Elevation="1.4490718" Material="copper" Name="GND_3_L6" Thickness="0.0171453" Type="conductor"/>
<Layer Color="#bd00bd" Elevation="1.1779265" Material="copper" Name="VCC1_L7" Thickness="0.0171453" Type="conductor"/>
<Layer Color="#008000" Elevation="0.9067812" Material="copper" Name="VCC2_L8" Thickness="0.0171453" Type="conductor"/>
<Layer Color="#00bdbd" Elevation="0.6356359" Material="copper" Name="GND_4_L9" Thickness="0.0171453" Type="conductor"/>
<Layer Color="#408000" Elevation="0.3644906" Material="copper" Name="Inner_Layer_3_L10" Thickness="0.0171453" Type="conductor"/>
<Layer Color="#000080" Elevation="0.09334530000000001" Material="copper" Name="GND_5_L11" Thickness="0.0171453" Type="conductor"/>
<Layer Color="#804000" Elevation="0" Material="copper" Name="Bottom_L12" Thickness="0.0171453" Type="conductor"/>
<Layer Color="#353981" Name="Outline" Type="outline"/>
</Layers>
</ELayers>
</Stackup>
</c:Control>