Material Properties
The printed circuit board is modeled using PCB laminate, Epoxy/Glass Fiber FR4 and the package components are modeled with Plastic, PI (thermoplastic) with material properties as listed in the tables below:
| PCB laminate, Epoxy/Glass fiber, FR-4.0 | |
|---|---|
| Young's modulus (Pa) | 2.437e10 |
| Poisson's ratio | 0.165 |
| Density (kg/m3) | 1944 |
| Plastic, PI (thermoplastic) | |
|---|---|
| Young's modulus (Pa) | 2.478e9 |
| Poisson's ratio | 0.399 |
| Density (kg/m3) | 1379 |
For all components in this example linear isotropic materials are assumed, which are suitable for preliminary design. A more detailed validation analysis may use an orthotropic Young’s modulus to represent the stiffness behavior of the printed circuit board more accurately.
