Ansys Workbench
The following properties can be exported to Ansys Workbench, depending on which record you are exporting and which model you select.
Note: This feature is only available in Level 3 databases of
Granta EduPack 2026 R1.
Note: Only compatible with Ansys Workbench v12 onwards.
If you are exporting data using the Granta EduPack add-in for Ansys Workbench, any data you export will appear in the Engineering Data section of Granta EduPack in your Ansys Workbench project. You can export from one table at a time, and only the final export will be saved to Engineering Data when you close Granta EduPack.
MaterialUniverse
- Coercive force Hc
- Compressive strength
- Density
- Density with temperature
- Designation
- Dynamic viscosity (absolute viscosity)
- Dynamic viscosity with temperature
- Electrical resistivity
- Electrical resistivity with temperature
- Fatigue S-N curve
- Magnetic B-H curve, initial
- Magnetic B-H curve, demagnetization
- Maximum permeability
- Poisson's ratio
- Remanent induction Br
- Specific heat capacity
- Specific heat capacity with temperature
- Tangent modulus
- Tensile strength
- Tensile strength with temperature
- Thermal conductivity
- Thermal conductivity with temperature
- Thermal expansion coefficient
- Thermal expansion coefficient with temperature
- Thermal expansion coefficient with temperature_Reference Temp
- True plastic stress-strain
- Yield strength (elastic limit)
- Yield strength with temperature
- Young's modulus
- Young's modulus with temperature
Global Polymers Plastics
- CLTE, Flow
- CLTE, Flow (TMA)
- CLTE, Transverse
- CLTE, Transverse (TMA)
- Coeff of Thermal Expansion vs. Temperature
- Compressive Strength
- Creep Model Parameters_C1
- Creep Model Parameters_C2
- Creep Model Parameters_C3
- Creep Model Parameters_C4
- Creep Model Parameters_C5
- Creep Model Parameters_C6
- Creep Model Parameters_Creep Model
- Creep Model Parameters_Reference Units
- Density
- Density (Uncured)
- Density vs. Temperature
- Elongation at Break MD (Films)
- Elongation at Break TD (Films)
- Flexural Modulus
- Nominal Tensile Elongation at Break
- Poisson's Ratio
- Poisson's Ratio vs. Temperature
- Prony Shear Relaxation | Number of Terms
- Prony Shear Relaxation | Relative Moduli
- Prony Shear Relaxation | Relaxation Time
- Prony Volumetric Relaxation | Number of Terms
- Prony Volumetric Relaxation | Relative Moduli
- Prony Volumetric Relaxation | Relaxation Time
- Shear Relaxation Modulus vs. Time
- Specific Heat Capacity
- Specific Heat Capacity vs. Temperature
- Tensile Elongation at Break
- Tensile Elongation at Break (Cured)
- Tensile Elongation at Break (Elastomers)
- Tensile Elongation at Break (Films)
- Tensile Fatigue
- Tensile Modulus
- Tensile Modulus (Cured)
- Tensile Modulus (Films)
- Tensile Modulus vs. Temperature
- Tensile Modulus vs. Temperature, Dynamic
- Tensile Strength
- Tensile Strength (Cured)
- Tensile Strength (Elastomers)
- Tensile Strength (Films)
- Tensile Strength at Break
- Tensile Strength at Yield
- Tensile Strength at Yield (Elastomers)
- Tensile Strength at Yield (Films)
- Tensile Strength at Yield MD (Films)
- Tensile Strength at Yield TD (Films)
- Tensile Strength at Yield vs. Temperature
- Thermal Conductivity
- Thermal Conductivity vs. Temperature
- True Stress vs. Plastic Strain
- Volume Resistivity
- Volume Resistivity (Cured)
- Volume Resistivity vs. Temperature
MMPDS
- Comp Yield Strength, L
- Comp. Yield Stress (L-dir) with Temp.
- Density
- Electrical Conductivity
- Fatigue Best Fit (S/N), L
- Modulus, L
- Poisson's Ratio (L-dir) with Temp.
- Poisson's Ratio, L
- Specific Heat
- Specific Heat with Temp.
- Tens. Ult. Stress (L-dir) with Temp.
- Tens. Yield Stress (L-dir) with Temp.
- Tensile Modulus (L-dir) with Temp.
- Tensile Stress/Strain, L
- Thermal Conductivity
- Thermal Conductivity with Temp.
- Thermal Expansion
- Thermal Expansion with Temp.
- Ultimate Tensile Strength, L
- Yield Strength, L