• User Experience and Workflow Enhancements
  • Solution loading enhancements
  • Field plot and field summary enhancements
  • Case file migration to HDF5
  • CTM improvements
  • Enhanced UI handling for industrial
  • Activate/deactivate parts and components
  • Snapping updates
  • Heat flux vectors added for post-processing
• Meshing, Solving, and Physics Enhancements
  • Network Schematic Editor
  • Heat exchanger boundary
  • Dynamic thermal modeling enhancements
  • Mesh fusion and primitive object meshing enhancements
  • Native Joule heating for CPU and GPU (Beta)
• System Level Thermal Integrity Solutions
  • STM generation and workflow enhancements
  • Discovery export to Icepak with boundaries and excitations (Beta)
• Package-and-PCB Workflow Enhancements
  • Layout component enhancements
  • Package Native Component (Beta)