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Chip-Package-System (CPS) methodology in SIwave combines the Integrated Circuit (IC) model or chip, the packages that contain the chips, and the printed circuit board (PCB) into a single system for simulation. The CPS process flow includes both design and analysis activities.

Design activities include:

PCB Design – Import and set up the PCB.
Package Design – Import and merge packages with the PCB.
IC Design (CPM) – Import and merge the IC models with the corresponding packages on the PCB.
System Design – Complete the integrated PCB System by adding vias, solder balls, and decoupling components.

Analysis activities include:

SIwave Solvers – Simulate with the field and circuit solvers built into SIwave.
Cosimulate – Cosimulate with circuit and thermal tools.
Export 3D Model – Export a 3D model to MCAD solvers.
Export Sentinel SSO Netlist – Export a SPICE netlist with CPP header for Sentinel-SSO flow.

Click any activity in the CPS Process Flow diagram below for more information.

CPS Process Flow - Click an Activity for More Information