Adding Solderballs to a Package

Solderballs connect a BGA type package to the PCB at a designated reference designator location.

To create a solderball:

1. Click Home > Solderball Properties.

The Solderball Properties window appears.



2. From the Padstacks area, select a padstack to define solderballs.
3. From the Type drop-down menu, select Simple, Complex, or Oblong. The Solderball Dimensions section updates to reflect required fields.
4. From the Material drop-down menu, select a material for the solderball.
5. Click the Color swatch to select a color for the solderball(s). The default is gray.
6. From the Solderball Placement area, use the radio buttons to place the solderball either Above Layer Stackup or Below Layer Stackup.
7. From the Terminal Type area, use the radio buttons to set solderballs as sinks or sources globally, or to leave types as is.
8. From the Solderball Dimensions area, enter the applicable dimensions, in mils. As you make changes, the new shape of the solderball previews in the window. A simple, complex, and oblong solderball are shown below.



9. Click OK.

Solderballs are added to every instance of the specified padstacks in the layout.