Packages - Flipchip_BGA

Flipchip_BGA enables you to create geometry and boundary conditions to represent a flipchip ball grid array package.

Name	The Name appears in the Project Manager window, history tree, and 3D Modeler window.
Plane	Plane specifies the plane on which to create the package.
Location	Under Location, specify the starting coordinates for the package geometry relative to center of the 3D Modeler.
Size	Under Size, specify the length of the package in each coordinate direction. The coordinate direction represented by Package Thickness depends on the selected Plane.
Model Specs	Under Model Specs, specify the Model Type as Detailed, Compact Conduction Model (CCM), Characterize JC, or Characterize JB and select a Symmetry.

Substrate	Under Substrate, specify the Number of Layers, Substrate Thickness, and Substrate Material.
Trace	Under Trace, specify the coverage percentage for the top trace, bottom trace, first internal layer, and second internal layer. Also specify the Trace Thickness and Trace Material.
Vias	Under Vias, specify the number of vias and via diameter and thickness.

Distribution	Under Distribution, enter the number of rows for solder balls, the Array Type. For a Peripheral Array, specify the number of rows to be suppressed and number of central rows.
Ball	Under Ball, specify the dimensions of the solder balls, including pitch, diameter, and height. Also, specify the material for the solder balls.

Die	Under Die, specify the length of the die in each coordinate direction. Also, specify the die power and material.
Die Underfill	Under Die Attach, specify the bump size of the die underfill material and the material.
Heatsink	Under Heatsink, specify whether to include a heatsink in the package. If so, specify the heatsink thickness and material.

Iron Python Script – Flipchip_BGA.py:

The following is the toolkit's scripting information.

data = ["ng",

'length_unit:meter',

'power_unit:W',

'Plane:XY',

'xS:0.0',

'yS:0.0',

'zS:0.0',

'Length1:0.015',

'Length2:0.015',

'Package Thickness:0.0016',

'Model Type:Detailed',

'Symmetry:Full',

'Substrate Thickness:0.00036',

'Substrate Material:Epoxy Resin-Typical',

'Top Trace:55.0',

'Bottom Trace:55.0',

'1st Int. Layer Coverage:0.0',

'2nd Int. Layer Coverage:0.0',

'Trace Thickness:0.000033',

'Trace Material:Cu-Pure',

'Number of Thermal Vias:0',

'Via Diameter:0.0002',

'Via Plate Thickness:0.00005',

'Number of Rows 1:14',

'Number of Rows 2:14',

'Array Type:Full Array',

'Suppressed Rows 1:0',

'Suppressed Rows 2:0',

'Central Rows 1:0',

'Central Rows 2:0',

'Ball Pitch:0.001',

'Ball Diameter:0.0005',

'Ball Height:0.0005',

'Ball Material:Solder-pb50_sn50',

'Die Length1:0.00856',

'Die Length2:0.00856',

'Power:1',

'Die Material:Si-Typical',

'Underfill Bump Size:0.00036',

'Underfill Material:Flipchip_underfill',

'Include Heatsink:Yes',

'Heatsink Thickness:0.0001',

'Heatsink Material:Cu-Pure'

]

oDesign.RunToolkit("SysLib", "Geometry/Packages/Flipchip_BGA", [])

oDesign.RunToolkit("SysLib", "Geometry/Packages/Flipchip_BGA", ["ng"])

oDesign.RunToolkit("SysLib", "Geometry/Packages/Flipchip_BGA", data)